LGA 1200, also known as Socket H5, is a zero insertion force flip-chip land grid array (LGA) socket, compatible with Intel desktop processors Comet Lake (10th gen) and Rocket Lake (11th-gen) desktop CPUs, which was released in April 2020.

LGA 1200 is designed as a replacement for the LGA 1151 (known as Socket H4). LGA 1200 is a land grid array mount with 1200 protruding pins to make contact with the pads on the processor. It uses a modified design of LGA 1151, with 49 more pins on it, improving power delivery and offering support for future incremental I/O features. Pin 1 position remains the same as it was in previous generation processors, but it has shifted socket keying to left (previously it was right), making Comet Lake processors incompatible both electrically and mechanically with previous chips.

ASRock, Asus, Biostar, Gigabyte and MSI have confirmed their motherboards based on the Intel Z490 chipset support the 11th generation Intel Rocket Lake desktop CPUs. Full PCIe 4.0 support is confirmed for selected brands. ASUS did not include support to PCIe 4.0 on M.2, hindering support for PCIe gen 4.0 NVMe SSDs.

Heatsink

Pads of an Intel Core i9-10900K

The 4 holes for fastening the heatsink to the motherboard are placed in a square with a lateral length of 75 mm for Intel's sockets LGA 1156, LGA 1155, LGA 1150, LGA 1151 and LGA 1200. Cooling solutions should therefore be interchangeable.

Comet Lake chipsets (400 series)

Memory support configuration common for all chipsets:

  • Dual channel DDR4-2666 or DDR4-2933
OverclockingThermal limits CPU overclocking is offered by ASRock, ASUS and MSINoYesNo
Bus InterfaceDMI 3.0 x4
CPU supportComet Lake-S onlyComet Lake-S / Rocket Lake (a BIOS update is required)
Memory supportUp to 64 GBUp to 128 GB
Maximum DIMM slots24
ECC memoryNoUDIMM
Maximum USB 2.0 ports101214
USB 3.2 ports configurationGen 1x1Up to 4Up to 8Up to 10
Gen 2x1N/AUp to 4Up to 6Up to 8
Maximum SATA 3.0 ports468
Processor PCI Express v3.0 configuration1x161x16 or 2x8 or 1x8+2x4
PCH PCI Express configuration6162024
Independent Display Support (digital ports/pipes)23
Integrated Wireless (802.11ax)NoIntel Wi-Fi 6 AX201
SATA RAID 0/1/5/10 supportNoYes
Intel Optane Memory Support
Technology
Intel Active Management, Trusted Execution and vPro TechnologyNoYesNoYes
Chipset TDP6W
Chipset lithography22 nm14 nm
Release dateQ2 2020

Rocket Lake chipsets (500 series)

Memory support configuration common for all chipsets (except W580):

  • Dual channel
  • DDR4-3200 for 11th generation Rocket Lake Core i9/i7/i5 CPUs
  • DDR4-2933 for 10th generation Comet Lake Core i9/i7 CPUs
  • DDR4-2666 for all other CPUs
  • Up to 128 GB using 32 GB modules; maximum 64 GB for the H510 chipset

W580 based motherboards support DDR4-3200 RAM in dual channel mode.

OverclockingNoRAM onlyNoYesRAM only
Bus InterfaceDMI 3.0 x4DMI 3.0 x8 (runs in x4 mode for Comet Lake-S CPUs)
CPU supportComet Lake-S / Rocket LakeRocket Lake
Maximum DIMM slots24
ECC memoryNoUDIMM
Maximum USB 2.0 ports101214
USB 3.2 ports configurationGen 1x1Up to 4Up to 6Up to 8Up to 10Up to 10
Gen 2x1—N/aUp to 4Up to 8
x2Up to 2Up to 3
Maximum SATA 3.0 ports468
Processor PCI Express v4.0 configuration1x161x16 + 1x41x16 + 1x4 or 2x8 + 1x4 or 1x8 + 3x4
PCH PCI Express configuration6122024
Independent Display Support (digital ports/pipes)23
Integrated Wireless (802.11ax)Intel Wi-Fi 6 AX201
PCIe RAID 0/1/5/10 supportNoYes
SATA RAID 0/1/5/10 supportNoYes
Intel Optane Memory SupportNoYes
Technology
Intel Active Management, Trusted Execution and vPro TechnologyNoYesNoYes
Chipset TDP6W
Chipset lithography14 nm[citation needed]
Release dateQ1 2021Q2 2021Q1 2021Q2 2021

See also