List of Intel Core processors

The following is a list of Intel Core processors. This includes Intel's original Core (Solo/Duo) mobile series based on the Enhanced Pentium M microarchitecture; as well as its Core 2– (Solo/Duo/Quad/Extreme), Core i3–, Core i5–, Core i7–, Core i9–, Core M– (m3/m5/m7/m9), Core 3–, Core 5–, Core 7–, and Core 9–branded processors.

Desktop processors

Release timelineDesktop processors
2009
2008	Core i 1st generation (Nehalem microarchitecture)
2010	Core i 1st generation (Westmere microarchitecture)
2011	Core i 2nd generation (Sandy Bridge microarchitecture)
2012	Core i 3rd generation (Ivy Bridge microarchitecture)
2013	Core i 4th generation (Haswell microarchitecture)
2014
2015	Core i 5th generation (Broadwell microarchitecture)
Core i 6th generation (Skylake microarchitecture)
2016
2017	Core i 7th generation (Kaby Lake microarchitecture)
Core i 8th generation (Coffee Lake microarchitecture)
2018	Core i 9th generation (Coffee Lake microarchitecture)
2019
2020	Core i 10th generation (Comet Lake microarchitecture)
2021	Core i 11th generation (Rocket Lake)
2022	Core i 12th generation (Alder Lake)
2023	Core i 13th generation (Raptor Lake)
Core i 14th generation (Raptor Lake)
2024	Core Ultra Series 2 (Arrow Lake)

Core 2

"Allendale" (65 nm, 800 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)a
Die size: 111 mm2
Steppings: L2b, M0c, G0d

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SL9TB (L2) SLA99 (M0) SLA5G	2	1.8 GHz	2 MB	800 MT/s	9×	0.85–1.5 V	65 W	LGA 775	January 2007	HH80557PG0332M BX80557E4300	$163
SLA3F (L2) SLA98 (M0) SLA5F	2	2 GHz	2 MB	800 MT/s	10×	0.85–1.5 V	65 W	LGA 775	April 2007	HH80557PG0412M BX80557E4400	$133
SLA95 (M0)	2	2.2 GHz	2 MB	800 MT/s	11×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PG0492M BX80557E4500	$133
SLA94 (M0)	2	2.4 GHz	2 MB	800 MT/s	12×	1.162–1.312 V	65 W	LGA 775	October 2007	HH80557PG0562M BX80557E4600	$133
SLALT (G0)	2	2.6 GHz	2 MB	800 MT/s	13×	1.162–1.312 V	65 W	LGA 775	March 2008	HH80557PG0642M BX80557E4700	$133

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

^d Note: The E4700 uses G0 Stepping which makes it a Conroe CPU.

"Conroe" (65 nm, 1066 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)a
All models support: Intel VT-x
Die size: 143 mm2
Steppings: B2, G0

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SL9SA (B2) SL9TA (L2) SLA2L (?) SLA5E (?)	2	1.87 GHz	2 MB	1066 MT/s	7×	0.85–1.5 V	65 W	LGA 775	July 2006	HH80557PH0362M BX80557E6300 BX80557E6300T2	$183
SLA4U (B2)	2	1.87 GHz	4 MB	1066 MT/s	7×	0.85–1.5 V	65 W	LGA 775	April 2007	HH80557PH0364M BX80557E6320	$163
SL9S9 (B2) SLA5D (?) SL9T9 (L2) SLA97 (M0)	2	2.13 GHz	2 MB	1066 MT/s	8×	0.85–1.5 V	65 W	LGA 775	July 2006	HH80557PH0462M BX80557E6400	$224
SLA4T (B2)	2	2.13 GHz	4 MB	1066 MT/s	8×	0.85–1.5 V	65 W	LGA 775	April 2007	HH80557PH0464M BX80557E6420	$183
SL9S8 (B2) SL9ZL (B2)	2	2.4 GHz	4 MB	1066 MT/s	9×	0.85–1.5 V	65 W	LGA 775	July 2006	HH80557PH0564M BX80557E6600	$316
SL9S7 (B2) SL9ZF (B2)	2	2.67 GHz	4 MB	1066 MT/s	10×	0.85–1.5 V	65 W	LGA 775	July 2006	HH80557PH0674M BX80557E6700	$530

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe" (65 nm, 1333 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)a
All models support: Intel VT-x
All E6x50 models support: Intel VT-x, Trusted Execution Technology (TXT)
Die size: 143 mm2
Transistor count: 291 million
Steppings: B2, G0

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLAA5 (G0)	2	2.33 GHz	4 MB	1333 MT/s	7×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PJ0534M	$163
SLA9X (G0) SLAAT (?)	2	2.33 GHz	4 MB	1333 MT/s	7×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PJ0534MG BX80557E6550 BX80557E6550R	$163
SLA9V (G0) SLAAR (?)	2	2.67 GHz	4 MB	1333 MT/s	8×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PJ0674MG BX80557E6750 BX80557E6750R	$183
SLA9U (G0)	2	3 GHz	4 MB	1333 MT/s	9×	0.85–1.5 V	65 W	LGA 775	July 2007	HH80557PJ0804MG BX80557E6850	$266

^a Note: of the E6000 series processors, only models E6550, E6750, and E6850 support Intel's Trusted Execution Technology (TXT).

^b Note: The L2 Stepping, and models with sSpec SL9ZL, SL9ZF, SLA4U, SLA4T, have better optimizations to lower idle power consumption from 22W to 12W.

^c Note: The M0 and G0 Steppings have better optimizations to lower idle power consumption from 12W to 8W.

"Conroe-CL" (65 nm, 1066 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 111 mm2 (Conroe)
Steppings: ?

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SLAGF	2	1.87 GHz	2 MB	1066 MT/s	7×		65 W	LGA 771		HH80557KH036F
	SLAGG	2	2.13 GHz	2 MB	1066 MT/s	8×		65 W	LGA 771		HH80557KH046F

"Conroe XE" (65 nm)

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 143 mm2
Steppings: B1, B2
The X6900 was never publicly released.

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SL9S5 (B2) QPHV (B1)	2	2.93 GHz	4 MB	1066 MT/s	11×	0.85–1.5 V	75 W	LGA 775	July 2006	HH80557PH0677M BX80557X6800	$999
Core 2 Extreme X6900	QTOM (B2) SL9S4 (B2)	2	3.2 GHz	4 MB	1066 MT/s	12×	0.85–1.5 V	75 W	LGA 775	N/A	HH80557PH0884M	N/A

"Kentsfield" (65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 2 ×143 mm2
Steppings: B3, G0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Quad Q6400	SL9UN (B3)	4	2.13 GHz	2 × 4 MB	1066 MT/s	8×	0.8500–1.500 V	105 W	LGA 775		HH80562PH0468M	OEM
	SL9UM (B3) SLACR (G0)	4	2.4 GHz	2 × 4 MB	1066 MT/s	9×	0.8500–1.500 V	105 W 95 W	LGA 775	January 2007	HH80562PH0568M BX80562Q6600 BXC80562Q6600	$851
	SLACQ (G0)	4	2.67 GHz	2 × 4 MB	1066 MT/s	10×	0.8500–1.500 V	95 W	LGA 775	July 2007	HH80562PH0678M BX80562Q6700 BXC80562Q6700	$530

"Kentsfield XE" (65 nm)

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 2 ×143 mm2
Steppings: B3, G0

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SL9UL (B3)	4	2.67 GHz	2 × 4 MB	1066 MT/s	10×	0.8500–1.500 V	130 W	LGA 775	November 2006	HH80562PH0678M	$999
SL9UK (B3) SLACP (G0)	4	2.93 GHz	2 × 4 MB	1066 MT/s	11×	0.8500–1.500 V	130 W	LGA 775	April 2007	HH80562PH0778M HH80562XH0778M	$1199
SLAFN (G0)	4	3 GHz	2 × 4 MB	1333 MT/s	9×	0.8500–1.500 V	130 W	LGA 775	July 2007	HH80562XJ0808M	$999

"Wolfdale-3M" (45 nm, 1066 MT/s)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
Die size: 82 mm2
Transistor Count: 230 million
Steppings: M0, R0
Models with a part number ending in "ML" instead of "M" support Intel VT-x

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLAPC (M0) SLAVN (M0) SLB9W (?)	2	2.53 GHz	3 MB	1066 MT/s	9.5×	0.85–1.3625 V	65 W	LGA 775	April 2008	EU80571PH0613M BX80571E7200	$133
SLAPB (M0) SLB9X (R0) SLGA9 (R0)	2	2.67 GHz	3 MB	1066 MT/s	10×	0.85–1.3625 V	65 W	LGA 775	August 2008	EU80571PH0673M AT80571PH0673M BX80571E7300	$133
SLB9Y (R0) SLGQ8 (R0) SLGW3 (R0, with VT)	2	2.8 GHz	3 MB	1066 MT/s	10.5×	0.85–1.3625 V	65 W	LGA 775	October 2008	AT80571PH0723M AT80571PH0723ML BX80571E7400	$133
SLB9Z (R0) SLGTE (R0, with VT)	2	2.93 GHz	3 MB	1066 MT/s	11×	0.85–1.3625 V	65 W	LGA 775	January 2009	AT80571PH0773M AT80571PH0773ML BX80571E7500	$133
SLGTD (R0, with VT)	2	3.07 GHz	3 MB	1066 MT/s	11.5×	0.85–1.3625 V	65 W	LGA 775	May 2009	AT80571PH0833ML BX80571E7600	$133

"Wolfdale" (45 nm, 1333 MT/s)

All models(except E8190) support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), iAMT2 (Intel Active Management Technology), Intel VT-x [a], Intel VT-d [b], Trusted Execution Technology (TXT)
Die size: 107 mm2
Transistor Count: 410 million
Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SLAQR (C0)	2	2.67 GHz	6 MB	1333 MT/s	8×	0.85–1.3625 V	65 W	LGA 775	January 2008	EU80570PJ0676MN	$163
	SLAPP (C0)	2	2.67 GHz	6 MB	1333 MT/s	8×	0.85–1.3625 V	65 W	LGA 775	January 2008	EU80570PJ0676M BX80570E8200	$163
Core 2 Duo E8290	SLAQQ (?)	2	2.83 GHz	6 MB	1333 MT/s	8.5×	0.85–1.3625 V	65 W	LGA 775	2008?	EU80570PJ0736MN	?
	SLAPJ (C0) SLAPN (C0)	2	2.83 GHz	6 MB	1333 MT/s	8.5×	0.85–1.3625 V	65 W	LGA 775	April 2008	EU80570AJ0736M EU80570PJ0736M	$163
	SLAPL (C0) SLB9J (E0)	2	3 GHz	6 MB	1333 MT/s	9×	0.85–1.3625 V	65 W	LGA 775	January 2008	EU80570PJ0806M AT80570PJ0806M BX80570E8400	$183
	SLAPK (C0) SLB9K (E0)	2	3.17 GHz	6 MB	1333 MT/s	9.5×	0.85–1.3625 V	65 W	LGA 775	January 2008	EU80570PJ0876M AT80570PJ0876M BX80570E8500	$266
	SLB9L (E0)	2	3.33 GHz	6 MB	1333 MT/s	10×	0.85–1.3625 V	65 W	LGA 775	August 2008	AT80570PJ0876M BX80570E8600	$266
Core 2 Duo E8700	SLB9E (E0)	2	3.5 GHz	6 MB	1333 MT/s	10.5×	0.85–1.3625 V	65 W	LGA 775	January 2009*	AT80570PJ1006M(OEM)	NA

a Note: The E8190 and E8290 do not support Intel VT-d.

Note 2: E8700 is a very rare example in Intel's history where a model was yanked from Intel ARK without a recall notice and after a SSPEC was assigned. Working examples were seen, believed to have been released to OEM, but none was offered in retail PCs.

See also: Versions of the same Wolfdale core in an LGA 771 are available under the Dual-Core Xeon brand.

"Yorkfield-6M" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x [a], Intel VT-d [b], Trusted Execution Technology (TXT) [c]
Die size: 2 × 82 mm2
Steppings: M0, M1, R0
All Q8xxx models are Yorkfield-6M MCMs with only 2 × 2 MB L2 cache enabled.

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLB5M (M1) SLG9S (R0)	4	2.33 GHz	2 × 2 MB	1333 MT/s	7×	0.85–1.3625 V	95 W	LGA 775	August 2008	EU80580PJ0534MN AT80580PJ0534MN	$224
SLG9T (R0) SLGSS (R0, with Intel VT-x)	4	2.33 GHz	2 × 2 MB	1333 MT/s	7×	0.85–1.3625 V	65 W	LGA 775	January 2009	AT80580AJ0534MN AT80580AJ0534ML	$245
SLB5W (R0) SLGUR (R0, with Intel VT-x)	4	2.5 GHz	2 × 2 MB	1333 MT/s	7.5×	0.85–1.3625 V	95 W	LGA 775	November 2008	AT80580PJ0604MN AT80580PJ0604ML	$224
SLGT6 (R0, with Intel VT-x)	4	2.67 GHz	2 × 2 MB	1333 MT/s	8×	0.85–1.3625 V	95 W	LGA 775	April 2009	AT80580PJ0674ML	$183
SLGT7 (R0, with Intel VT-x)	4	2.67 GHz	2 × 2 MB	1333 MT/s	8×	0.85–1.3625 V	65 W	LGA 775	April 2009	AT80580AJ0674ML	$245
SLAMX (M0) SLAWE (M1)	4	2.5 GHz	2 × 3 MB	1333 MT/s	7.5×	0.85–1.3625 V	95 W	LGA 775	March 2008	EU80580PJ0606M	$266
SLB6B (R0)	4	2.67 GHz	2 × 3 MB	1333 MT/s	8×	0.85–1.3625 V	95 W	LGA 775	August 2008	AT80580PJ0676M	$266
SLG9U (R0)	4	2.67 GHz	2 × 3 MB	1333 MT/s	8×	0.85–1.3625 V	65 W	LGA 775	January 2009	AT80580AJ0676M	$320
SLGZ4 (R0)	4	2.83 GHz	2 × 3 MB	1333 MT/s	8.5×	0.85–1.3625 V	95 W	LGA 775	January 2010	AT80580PJ0736ML	$183
SLGYY (R0)	4	2.83 GHz	2 × 3 MB	1333 MT/s	8.5×	0.85–1.3625 V	95 W	LGA 775	August 2009	AT80580PJ0736MG	$213
SLGYZ (R0)	4	2.83 GHz	2 × 3 MB	1333 MT/s	8.5×	0.85–1.3625 V	65 W	LGA 775	August 2009	AT80580AJ0736MG	$277

a Note: Q8200, Q8200S, Q8300 SLB5W does not support Intel VT-x.

b Note: Q8200, Q8200S, Q8300, Q8400, Q8400S, Q9500 does not support Intel VT-d.

c Note: Q8200, Q8200S, Q8300, Q8400, Q8400S does not support TXT.

Yorkfield (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Intel VT-d, Trusted Execution Technology (TXT)
Die size: 2 × 107 mm2
The "S" suffix denotes to low power consumption specs with 65W TDP, equivalent to that of a standard Core 2 Duo. Supplied to OEM channels only and mostly seen as options for SFF platforms. The first batch of Q9550S has no "S" marking on lid, thus only differentiated by SSPEC.
Steppings: C0, C1, E0

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLAN6 (C0) SLAWR (C1)	4	2.67 GHz	2 × 6 MB	1333 MT/s	8×	0.85–1.3625 V	95 W	LGA 775	March 2008	EU80569PJ067N	$316
SLAN4 (C0) SLAWQ (C1) SLB8V (E0)	4	2.83 GHz	2 × 6 MB	1333 MT/s	8.5×	0.85–1.3625 V	95 W	LGA 775	March 2008	EU80569PJ073N AT80569PJ073N	$530
SLGAE (E0)	4	2.83 GHz	2 × 6 MB	1333 MT/s	8.5×	0.85–1.3625 V	65 W	LGA 775	January 2009	AT80569AJ073N	$369
SLB8W (E0)	4	3 GHz	2 × 6 MB	1333 MT/s	9×	0.85–1.3625 V	95 W	LGA 775	August 2008	AT80569PJ080N BX80569Q9650	$530

"Yorkfield XE" (45 nm)

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
I/O Acceleration Technology (Intel I/OAT) supported by: QX9775
Intel VT-d supported by: QX9650
Die size: 2 × 107 mm2
Steppings: C0, C1, E0
The QX9750 was never publicly released. Engineering samples have surfaced along with claims that Intel gave them away to employees sometime in 2009.

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SLAN3 (C0) SLAWN (C1)	4	3 GHz	2 × 6 MB	1333 MT/s	9×	0.85–1.3625 V	130 W	LGA 775	November 2007	EU80569XJ080NL BX80569QX9650	$999
Core 2 Extreme QX9750	QJEE (E0) SLBBU (E0)	4	3.17 GHz	2 × 6 MB	1333 MT/s	9.5×	0.85–1.3625 V	130 W	LGA 775	N/A	AT80569XL087NL	N/A
	SLAN2 (C0) SLAWM (C1)	4	3.2 GHz	2 × 6 MB	1600 MT/s	8×	0.85–1.3625 V	136 W	LGA 775	March 2008	EU80569XL088NL BX80569QX9770	$1399
	SLANY (C0)	4	3.2 GHz	2 × 6 MB	1600 MT/s	8×	0.85–1.35 V	150 W	LGA 771	March 2008	EU80574XL088N BX80574QX9775	$1499

Core i (1st gen)

Lynnfield

Common features of Core i (1st gen) Lynnfield desktop processors:

Socket: LGA 1156.
All CPUs support the P55 chipset.
All the CPUs support dual-channel DDR3 RAM at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 45 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo
Core i7		4 (8)	3.06	3.73	8 MB	95 W	May 2010	US $583
	2.93	3.60	US $342
	September 2009	US $562
	2.67	82 W	July 2010	US $351
	2.80	3.46	95 W	September 2009	US $284
	2.53	82 W	January 2010	US $337
Core i5		4 (4)	2.80	3.33	95 W	July 2010	US $205
	2.66	3.20	September 2009	US $196
	2.40	82 W	January 2010	US $259

Bloomfield

Common features of Core i (1st gen) Bloomfield desktop processors:

Socket: LGA 1366.
All CPUs support the X58 chipset.
All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
All CPUs feature a QPI bus to the chipset (northbridge). Bus speed is 4.8 GT/s on all the processors except for the Extreme Edition models, which run at 6.4 GT/s.
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 45 nm.
Extreme Edition processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo
Core i7		4 (8)	3.33	3.60	8 MB	130 W	June 2009	US $999
	3.20	3.46	November 2008
	October 2009	US $562
	3.06	3.33	June 2009
	2.93	3.20	November 2008
	2.80	3.06	February 2010	US $294
	2.66	2.93	November 2008	US $284

Clarkdale

Common features of Core i (1st gen) Clarkdale desktop processors:

Socket: LGA 1156.
Supported chipsets: H55, H57, P55, Q57.
All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 1.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i5		2 (4)	3.60	3.86	HD Graphics	733	4 MB	73 W	April 2010	US $294
	3.46	3.73	January 2010	US $284
	3.33	3.60	900	87 W	US $196
	733	73 W
	3.20	3.46	May 2010	US $216
	January 2010	US $176
Core i3		3.33	—N/a	August 2010	US $138
	3.20	May 2010
	3.06	January 2010	US $133
	2.93	US $113

Gulftown

Common features of Core i (1st gen) Gulftown desktop processors:

Socket: LGA 1366.
All CPUs support the X58 chipset.
All the CPUs support triple-channel DDR3 RAM, at up to 1066 MT/s speed.
PCIe lanes are provided by the northbridge on the motherboard rather than by the CPU.
All CPUs feature a QPI bus to the chipset (northbridge). Bus speed is 4.8 GT/s on all the processors except for the X-suffix models, which run at 6.4 GT/s.
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo
Core i7		6 (12)	3.46	3.73	12 MB	130 W	February 2011	US $999
	3.33	3.60	March 2010
	June 2011	US $583
	3.20	3.46	July 2010	US $885

Core i (2nd gen)

Sandy Bridge-DT

Common features of Core i (2nd gen) desktop processors:

Socket: LGA 1155.
Supported chipsets: C206, Q67.
All the CPUs support dual-channel DDR3 RAM, at up to 1333 MT/s speed.
All CPU models provide 16 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i3-2120, i5-2400, and i7-2600 are available as embedded processors.
The Core i3-2102, once upgraded via Intel Upgrade Service, operates at 3.6 GHz, has 3 MB L3 cache and is recognized as Core i3-2153.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i7		4 (8)	3.5	3.9	HD 3000	850–1350	8 MB	95 W	October 2011	US $332
	3.4	3.8	January 2011	US $317
	HD 2000	US $294
	2.8	65 W	US $306
Core i5		4 (4)	3.4	—N/a	6 MB	95 W	January 2012	US $225
	3.3	3.7	HD 3000	850–1100	January 2011	US $216
	HD 2000	US $205
	2.7	65 W	US $216
	2.3	3.3	650–1250	45 W
	3.2	3.5	—N/a	95 W	January 2012	US $195
	3.1	3.4	HD 2000	850–1100	January 2011	US $184
	2.5	3.3	HD 3000	65 W	May 2011	US $205
	HD 2000	January 2011	US $195
	2 (4)	2.7	3.5	650–1100	3 MB	35 W	February 2011
	4 (4)	3.1	3.4	—N/a	6 MB	95 W	January 2012	US $177
	3.0	3.3	HD 2000	850–1100	September 2011
	2.9	3.2	May 2011
	2.8	3.1	January 2011
Core i3		2 (4)	3.4	—N/a	850–1100	3 MB	65 W	September 2011	US $138
	3.3	HD 3000	US $134
	HD 2000	February 2011	US $138
	2.6	650–1100	35 W	US $127
	3.1	HD 3000	850–1100	65 W	May 2011	US $134
	HD 2000	Q2 2011	US $127
	February 2011	US $117
	2.5	650–1100	35 W	US $127

Core i (3rd gen)

Ivy Bridge-DT

Common features of Core i (3rd gen) Ivy Bridge-DT desktop processors:

Socket: LGA 1155.
Supported chipsets: H77, Z75, Z77.
All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe. i5 and up models support it at PCIe 3.0 speeds while i3 models support it at PCIe 2.0 speeds.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i3-3220, i5-3550S and i7-3770 are available as embedded processors.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i7		4 (8)	3.5	3.9	HD 4000	650–1150	8 MB	77 W	April 2012	US $342
	3.4	US $305
	3.1	65 W	US $305
	2.5	3.7	45 W	US $294
Core i5		4 (4)	3.4	3.8	6 MB	77 W	US $225
	HD 2500	June 2012	US $205
	3.1	65 W
	2.3	3.3	45 W	April 2012
	3.3	3.7	77 W
	3.0	65 W
	3.2	3.6	650–1100	77 W	June 2012	US $184
	2.9	HD 4000	65 W	US $201
	HD 2500	US $184
	2 (4)	3 MB	35 W
	4 (4)	3.1	3.5	6 MB	77 W	April 2012
	2.8	65 W
	3.1	3.3	—N/a	69 W	September 2012	US $177
	HD 2500	650–1050	77 W	September 2013	US $182
	2.8	65 W
	3.0	3.2	77 W	September 2012
3335S	2.7	HD 4000	65 W	US $194
	HD 2500	US $177
Core i3		2 (4)	3.5	—N/a	3 MB	55 W	June 2013	US $138
	3.0	35 W
	3.4	HD 4000	55 W	US $134
	HD 2500	September 2012	US $138
	2.9	35 W
	3.3	HD 4000	55 W	US $134
	HD 2500	US $117
	2.8	35 W
	3.2	55 W	January 2013

Sandy Bridge-E

Common features of Core i (3rd gen) Sandy Bridge-E desktop processors:

Socket: LGA 2011.
All CPUs support the X79 chipset.
All the CPUs support quad-channel DDR3-1600 RAM.
All CPU models provide 40 lanes of PCIe 2.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 32 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo
Core i7		6 (12)	3.5	4.0	15 MB	150 W	November 2012	US $999
	3.3	3.9	130 W	November 2011
	3.2	3.8	12 MB	US $583
	4 (8)	3.6	3.8	10 MB	February 2012	US $294

Core i (4th gen)

Haswell-DT

Common features of Core i (4th gen) Haswell-DT desktop processors:

Socket: LGA 1150.
Supported chipsets: C222, C224, C226, H87, H97, Q87, Q97, Z87, Z97.
All the CPUs support dual-channel DDR3 RAM at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
The following models are available as embedded processors: i3- 4330, 4350T, 4360, i5- 4570S, 4590T, 4590S, i7- 4770S, 4790S.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i7		4 (8)	4.0	4.4	HD 4600	350–1250	8 MB	88 W	June 2014	US $350
	3.6	4.0	350–1200	84 W	May 2014	US $312
	3.2	65 W
	2.7	3.9	45 W	US $303
	2.2	3.2	35 W
	3.5	3.9	350–1250	84 W	June 2013	US $350
	350–1200	September 2013	US $320
	3.4	June 2013	US $312
	3.1	65 W	US $305
	2.5	3.7	45 W	US $303
	2.0	3.0	35 W
Core i5		4 (4)	3.5	3.9	6 MB	88 W	June 2014	US $242
	84 W	May 2014	US $213
	3.2	65 W
	2.5	3.5	45 W
	3.4	3.8	84 W	June 2013	US $242
	US $213
	3.1	65 W
	2.3	3.3	45 W
	3.3	3.7	350–1150	84 W	May 2014	US $192
	3.0	65 W
	2.0	3.0	35 W
	3.2	3.6	84 W	June 2013
	2.9	65 W
	2 (4)	200–1150	4 MB	35 W
4470	4 (4)	3.3	3.5	350–1100	6 MB	84 W	May 2014	OEM
	3.2	3.4	US $182
	2.9	65 W
	1.9	2.7	35 W	March 2014
	3.1	3.3	84 W	September 2013
	2.8	65 W
	3.0	3.2	84 W	June 2013
	2.7	65 W
Core i3		2 (4)	3.8	—N/a	350–1150	4 MB	54 W	July 2014	US $149
	3.3	200–1150	35 W	March 2015	US $138
	3.7	350–1150	54 W	May 2014	US $149
	3.2	200–1150	35 W	July 2014	US $138
	3.6	350–1150	54 W	May 2014
	3.1	200–1150	35 W
	3.6	350–1150	54 W	September 2013	US $149
	3.5	US $138
	3.0	200–1150	35 W
	3.7	HD 4400	350–1150	3 MB	54 W	March 2015	US $117
	3.2	200–1150	35 W
	3.6	350–1150	54 W	July 2014
	3.1	200–1150	35 W
	3.5	350–1150	54 W	May 2014
	3.0	200–1150	35 W
	3.4	350–1150	54 W	September 2013	US $122
	2.9	200–1150	35 W

Haswell-H

Common features of Core i (4th gen) Haswell-H desktop processors:

Socket: BGA 1364 (soldered).
Supported chipsets: H97, Z97.
All the CPUs support dual-channel DDR3 RAM, at up to 1600 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Haswell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 22 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date
Base	Turbo	Model	Clock (MHz)
Core i7		4 (8)	3.2	3.9	Iris Pro 5200	200–1300	6 MB	65 W	June 2013
Core i5		4 (4)	3.0	3.7	4 MB
	2.7	3.2	200–1150

Ivy Bridge-E

Common features of Core i (4th gen) Ivy Bridge-E desktop processors:

Socket: LGA 2011.
All CPUs support the X79 chipset.
All the CPUs support quad-channel DDR3-1866 RAM.
All CPU models provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo
Core i7		6 (12)	3.6	4.0	15 MB	130 W	September 2013	US $990
	3.4	3.9	12 MB	US $555
	4 (8)	3.7	10 MB	US $310

Core i (5th gen)

Broadwell-H

Common features of Core i (5th gen) Broadwell-H desktop processors:

Socket: LGA 1150 for C-suffix processors, BGA 1364 soldered for R-suffix.
Supported chipsets: H87, H97, Q87
All the CPUs support dual-channel DDR3 RAM. C-suffix processors support it at speeds up to 1600 MT/s, while R-suffix support it at 1866 MT/s.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Broadwell-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i7		4 (8)	3.3	3.8	Iris Pro 6200	300–1150	6 MB	65 W	June 2015	OEM
	3.7	US $366
Core i5		4 (4)	3.1	3.6	300–1100	4 MB	OEM
	US $276
	2.8	3.3	300–1050	OEM

Haswell-E

Common features of Core i (5th gen) Haswell-E desktop processors:

Socket: LGA 2011-3.
All CPUs support the X99 chipset.
All the CPUs support quad-channel DDR4-2133 RAM.
i7-5820K provides 28 lanes of PCIe 3.0; i7-5930K and 5960X provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 22 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo
Core i7		8 (16)	3.0	3.5	20 MB	140 W	August 2014	US $999
	6 (12)	3.5	3.7	15 MB	US $583
	3.3	3.6	US $389

Core i (6th gen)

Skylake-S

Common features of Core i (6th gen) Skylake-S desktop processors:

Socket: LGA 1151.
Supported chipsets: B150, C236, H110, H170, Q150, Q170.
All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i7		4 (8)	4.0	4.2	HD 530	350–1150	8 MB	91 W	August 2015	US $339
	3.4	4.0	65 W	September 2015	US $303
	2.8	3.6	350–1100	35 W
Core i5		4 (4)	3.5	3.9	350–1150	6 MB	91 W	August 2015	US $243
	3.3	65 W	September 2015	US $213
	2.7	3.5	350–1100	35 W
	3.2	3.6	350–1050	65 W	US $192
	2.5	3.1	350–1100	35 W
	2.8	3.4	HD 510	350–950	65 W	December 2015	US $182
	2.7	3.3	HD 530	September 2015
	2.2	2.8	35 W
Core i3		2 (4)	3.9	—N/a	350–1150	4 MB	51 W	US $148
	3.8	US $139
	3.3	350–950	35 W	US $138
	3.7	350–1050	3 MB	51 W	US $117
	3.2	350–950	35 W
	3.6	HD 510	350–1050	54 W	December 2015

Skylake-H

Common features of Core i (6th gen) Skylake-H desktop processors:

Socket: BGA 1440 (soldered).
Supported chipsets: B150, C236, H110, H170, Q150, Q170.
All the CPUs support dual-channel DDR4-2133 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
In addition to the Smart Cache (L3 cache), Skylake-H CPUs also contain 128 MB of eDRAM acting as L4 cache.
Fabrication process: 14 nm.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date
Base	Turbo	Model	Clock (MHz)
Core i7		4 (8)	3.3	3.9	Iris Pro 580	350–1150	8 MB	65 W	May 2016
Core i5		4 (4)	3.2	3.8	6 MB
	2.8	3.6	350–1100

Broadwell-E

Common features of Core i (6th gen) Broadwell-E desktop processors:

Socket: LGA 2011-3.
All CPUs support the X99 chipset.
All the CPUs support quad-channel DDR4-2400 RAM.
i7-6800K provides 28 lanes of PCIe 3.0; all other models provide 40 lanes of PCIe 3.0.
All CPUs feature a DMI 2.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix and X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo
Core i7		10 (20)	3.0	3.5	25 MB	140 W	May 2016	US $1723
	8 (16)	3.2	3.7	20 MB	US $1089
	6 (12)	3.6	3.8	15 MB	US $617
	3.4	US $434

Core i (7th gen)

Kaby Lake-S

Common features of Core i (7th gen) Kaby Lake-S desktop processors:

Socket: LGA 1151.
Supported chipsets: B250, C236, H270, Q250, Q270, Z270.
All the CPUs support dual-channel DDR4-2400 or DDR3L-1600 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i7		4 (8)	4.2	4.5	HD 630	350–1150	8 MB	91 W	January 2017	US $339
	3.6	4.2	65 W	US $303
	2.9	3.8	35 W
Core i5		4 (4)	3.8	4.2	6 MB	91 W	US $242
	3.5	4.1	65 W	US $213
	2.8	3.7	350–1100	35 W
	3.4	3.8	65 W	US $192
	2.7	3.3	35 W
	3.0	3.5	350–1000	65 W	US $182
	2.4	3.0	35 W
Core i3		2 (4)	4.2	—N/a	350–1150	4 MB	60 W	US $168
	4.1	51 W	US $157
	4.0	US $147
	3.5	350–1100	35 W
	3.9	3 MB	51 W	US $117
	3.4	35 W

Skylake-X

Common features of Core i (7th gen) Skylake-X desktop processors:

Socket: LGA 2066.
All CPUs support the X299 chipset.
All the CPUs support quad-channel DDR4-2400 RAM. Models i7-7820X and above support it up to 2666 MT/s speeds.
i7 models provide 28 lanes of PCIe 3.0; i9 models provide 44 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 1 MB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo 2.0	Turbo 3.0
Core i9		18 (36)	2.6	4.2	4.4	24.75 MB	165 W	September 2017	US $1999
	16 (32)	2.8	22 MB	US $1699
	14 (28)	3.1	4.3	19.25 MB	US $1399
	12 (24)	2.9	16.5 MB	140 W	August 2017	US $1199
	10 (20)	3.3	4.5	13.75 MB	June 2017	US $989
Core i7		8 (16)	3.6	11 MB	US $599
	6 (12)	3.5	4.0	—N/a	8.25 MB	US $389

Kaby Lake-X

Common features of Core i (7th gen) Kaby Lake-X desktop processors:

Socket: LGA 2066.
All CPUs support the X299 chipset.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
X-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo
Core i7		4 (8)	4.3	4.5	8 MB	112 W	June 2017	US $339
Core i5		4 (4)	4.0	4.2	6 MB	US $242

Core i (8th gen)

Coffee Lake-S

Common features of Core i (8th gen) desktop processors:

Socket: LGA 1151-2.
Supported chipsets: B360, H310, H370, Q370, Z370.
All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i7		6 (12)	4.0	5.0	UHD 630	350–1200	12 MB	95 W	June 2018	US $425
	3.7	4.7	October 2017	US $359
	3.2	4.6	65 W	US $303
	2.4	4.0	35 W	April 2018
Core i5		6 (6)	3.6	4.3	350–1150	9 MB	95 W	October 2017	US $257
	3.1	65 W	April 2018	US $213
	2.3	3.7	35 W
	3.0	4.1	350–1100	65 W	US $192
	2.1	3.5	35 W
	2.8	4.0	350–1050	65 W	October 2017	US $182
	1.7	3.3	35 W	April 2018
Core i3		4 (4)	4.0	—N/a	350–1150	8 MB	91 W	October 2017	US $168
	3.7	62 W	April 2018	US $138
	3.2	350–1100	35 W
	3.6	6 MB	65 W	October 2017	US $117
8100F	—N/a	January 2019
	3.1	UHD 630	350–1100	35 W	April 2018

Core i (9th gen)

Coffee Lake-R

Common features of Core i (9th gen) Coffee Lake-R desktop processors:

Socket: LGA 1151-2.
Supported chipsets: B360, H310, H370, Q370, Z370.
All the CPUs support dual-channel DDR4 RAM at up to 2400 MT/s speed. Models i5 and up support it at up to 2666 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9-9900KS has all-core boost clock of 5.0 GHz.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i9		8 (16)	4.0	5.0	UHD 630	350–1200	16 MB	127 W	October 2019	US $524
	3.6	95 W	October 2018	US $488
	—N/a	January 2019	US $463
	3.1	UHD 630	350–1200	65 W	April 2019	US $439
	2.1	4.4	35 W
Core i7		8 (8)	3.6	4.9	12 MB	95 W	October 2018	US $374
	—N/a	January 2019
	3.0	4.7	UHD 630	350–1200	65 W	April 2019	US $323
	—N/a
	2.0	4.3	UHD 630	350–1200	35 W
Core i5		6 (6)	3.7	4.6	350–1150	9 MB	95 W	October 2018	US $262
	—N/a	January 2019	US $263
	3.1	UHD 630	350–1150	65 W	April 2019	US $213
	2.3	3.9	35 W
	3.0	4.2	350–1100	65 W	US $192
	—N/a
	2.2	3.7	UHD 630	350–1100	35 W
	2.9	4.1	350–1050	65 W	January 2019	US $182
	—N/a
	1.8	3.4	UHD 630	350–1050	35 W	April 2019
Core i3		4 (4)	4.0	4.6	350–1150	8 MB	91 W	US $173
	—N/a	January 2019
	3.7	4.4	UHD 630	350–1150	62 W	April 2019	US $154
	4.3	US $143
	3.2	3.8	350–1100	35 W
	3.6	4.2	6 MB	65 W	US $122
	—N/a
	3.1	3.7	UHD 630	350–1100	35 W

Skylake-X (9xxx)

Common features of Core i (9th gen) Skylake-X desktop processors:

Socket: LGA 2066.
All CPUs support the X299 chipset.
All the CPUs support quad-channel DDR4-2666 RAM.
All CPU models provide 44 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 1 MB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo 2.0	Turbo 3.0
Core i9	9990XE	14 (28)	4.0	5.0	5.0	19.25 MB	255 W	January 2019	OEM
	18 (36)	3.0	4.4	4.5	24.75 MB	165 W	Q4 2018	US $1979
	16 (32)	3.1	22 MB	US $1684
	14 (28)	3.3	19.25 MB	US $1387
	12 (24)	3.5	US $1189
	10 (20)	US $989
	3.3	4.1	4.2	16.5 MB	US $889
Core i7		8 (16)	3.8	4.4	4.5	November 2018	US $589

Core i (10th gen)

Comet Lake-S

Common features of Core i (10th gen) Comet Lake-S desktop processors:

Socket: LGA 1200.
Supported chipsets: B460, H410, H420E, H470, Q470, Q470E, W480, W480E.
All the CPUs support dual-channel DDR4 RAM at up to 2666 MT/s speed. Models i7 and up support it at up to 2933 MT/s speed.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0, while i5 and i3 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	TVB	Model	Clock (MHz)
Core i9		10 (20)	3.7	5.2	5.3	UHD 630	350–1200	20 MB	125 W	April 2020	US $488
	—N/a	US $472
	3.6	5.0	—N/a	UHD 630	350–1200	Q3 2020	OEM
	2.8	5.1	5.2	65 W	April 2020	US $439
	—N/a	US $422
	1.9	4.6	—N/a	UHD 630	350–1200	35 W	US $439
	3.6	5.1	5.2	125 W	July 2020	US $453
Core i7		8 (16)	3.8	5.1	—N/a	16 MB	May 2020	US $374
	—N/a	US $349
	2.9	4.8	UHD 630	350–1200	65 W	US $323
	—N/a	US $298
	2.0	4.5	UHD 630	350–1200	35 W	US $325
Core i5		6 (12)	4.1	4.8	12 MB	125 W	April 2020	US $262
	—N/a	US $237
	3.3	UHD 630	350–1200	65 W	US $213
	2.4	4.0	35 W
	3.1	4.5	350–1150	65 W	US $192
	2.3	3.8	35 W
	2.9	4.3	350–1100	65 W	US $182
	—N/a	US $157
	2.0	3.6	UHD 630	350–1100	35 W	US $182
Core i3		4 (8)	3.8	4.6	350–1150	8 MB	65 W	US $154
	3.7	4.4	US $143
	3.0	3.9	350–1100	35 W
	3.6	4.3	6 MB	65 W	US $122
	—N/a	October 2020	US $97
	3.0	3.8	UHD 630	350–1100	35 W	April 2020	US $122

Comet Lake-S (refresh)

Released on the same day as the 11th gen Rocket Lake-S desktop processors.

Common features of Core i (10th gen) Comet Lake-S (refresh) desktop processors:

Socket: LGA 1200.
Supported chipsets: B460, H410, H420E, H470, Q470, Q470E, W480, W480E.
All the CPUs support dual-channel DDR4-2666 RAM.
All CPU models provide 16 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 4-lane bus to the chipset (PCH).
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 256 KB per core.
Fabrication process: 14 nm.
All models support Turbo Boost 2.0.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	Model	Clock (MHz)
Core i5		6 (12)	3.2	4.6	UHD 630	350–1200	12 MB	65 W	March 2021	US $192
Core i3		4 (8)	3.9	4.7	350–1150	8 MB	US $154
	3.8	4.5	US $143
	3.0	4.0	350–1100	35 W
	3.7	4.4	6 MB	65 W	US $122
	—N/a	US $97
	3.0	3.9	UHD 630	350–1100	35 W	US $122

Cascade Lake-X (10xxx)

Common features of Core i (10th gen) Cascade Lake-X desktop processors:

Socket: LGA 2066.
All CPUs support the X299 chipset.
All the CPUs support quad-channel DDR4-2933 RAM.
All CPU models provide 48 lanes of PCIe 3.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
No integrated graphics.
L1 cache: 64 KB (32 KB data + 32 KB instructions) per core.
L2 cache: 1 MB per core.
Fabrication process: 14 nm.
X-suffix, and XE-suffix processors have an unlocked multiplier and can be overclocked.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Smart Cache	TDP	Release date	MSRP
Base	Turbo 2.0	Turbo 3.0
Core i9		18 (36)	3.0	4.6	4.8	24.75 MB	165 W	October 2019	US $979
	14 (28)	3.3	19.25 MB	US $784
	12 (24)	3.5	US $689
	10 (20)	3.7	4.5	4.7	US $590

Core i (11th gen)

Rocket Lake-S

Common features of Core i (11th gen) Rocket Lake-S desktop processors:

Socket: LGA 1200.
Supported chipsets: B560, H510, H570, Q570, Z590.
All the CPUs support dual-channel DDR4-3200 RAM. The Core i9 K/KF processors enable a 1:1 ratio of DRAM to memory controller by default at DDR4-3200, whereas the Core i9 non K/KF and all other CPUs listed below enable a 2:1 ratio of DRAM to memory controller by default at DDR4-3200 and a 1:1 ratio by default at DDR4-2933.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 3.0 8-lane bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 512 KB per core.
Fabrication process: 14 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Base	Turbo	TVB	Model	Clock (MHz)
Core i9		8 (16)	3.5	5.2	5.3	UHD 750	350–1300	16 MB	125 W	March 2021	US $539
	—N/a	US $513
	2.5	5.1	5.2	UHD 750	350–1300	65 W	US $439
	—N/a	US $422
	1.5	4.9	—N/a	UHD 750	350–1300	35 W	US $439
Core i7		3.6	5.0	125 W	US $399
	—N/a	US $374
	2.5	4.9	UHD 750	350–1300	65 W	US $323
	—N/a	US $298
	1.4	4.6	UHD 750	350–1300	35 W	US $323
Core i5		6 (12)	3.9	4.9	12 MB	125 W	US $262
	—N/a	US $237
	2.8	4.8	UHD 750	350–1300	65 W	US $213
	1.7	4.1	35 W
	2.7	4.6	65 W	US $192
	1.5	3.9	350–1200	35 W
	2.6	4.4	UHD 730	350–1300	65 W	US $182
	—N/a	US $157
	1.3	3.7	UHD 730	350–1200	35 W	US $182

Tiger Lake-B

Common features of Core i (11th gen) Tiger Lake-B desktop processors:

Socket: BGA 1787 (soldered).
All the CPUs support dual-channel DDR4-3200 RAM.
All CPU models provide 20 lanes of PCIe 4.0.
All CPUs feature a DMI 3.0 bus to the chipset (PCH).
L1 cache: 80 KB (48 KB data + 32 KB instructions) per core.
L2 cache: 1.25 MB per core.
Fabrication process: 10 nm.
K-suffix processors have an unlocked multiplier and can be overclocked.
were sold to OEMs only.

Processor branding	Model	Cores (Threads)	Clock rate (GHz)	Integrated GPU	Smart Cache	TDP	Release date
Base	Turbo	Model	Clock (MHz)
Core i9		8 (16)	3.3	4.9	UHD Graphics (32 EU)	350–1450	24 MB	55–65 W	May 2021
Core i7		3.2	4.8
Core i5		6 (12)	3.3	4.6	12 MB	65 W
Core i3		4 (8)	3.6	4.4	UHD Graphics (16 EU)	350–1400

Core i (12th gen)

Alder Lake-S

Common features of Core i (12th gen) desktop processors:

Socket: LGA 1700.
Supported chipsets: B660, H610, H670, Q670E, R680E, W680, Z690.
All the CPUs support dual-channel DDR4-3200 or DDR5-4800 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache: P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache: P-cores: 1.25 MB per core. E-cores: 2 MB per E-core cluster (each "cluster" contains four cores)
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)	E-core (efficiency)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Cores (Threads)	Clock rate (GHz)	Cores (Threads)	Clock rate (GHz)	Model	Clock (MHz)	Base	Max. Turbo
Base	Turbo	TVB	Base	Turbo
Core i9		8 (16)	3.4	5.3	5.5	8 (8)	2.5	4.0	UHD 770	300–1550	30 MB	150 W	241 W	April 2022	US $739
	3.2	5.2	—N/a	2.4	3.9	125 W	November 2021	US $589
	—N/a	US $564
	2.4	5.1	1.8	3.8	UHD 770	300–1550	65 W	202 W	January 2022	US $489
	—N/a	US $464
	1.4	4.9	1.0	3.6	UHD 770	300–1550	35 W	106 W	US $489
Core i7		3.6	5.0	4 (4)	2.7	3.8	300–1500	25 MB	125 W	190 W	November 2021	US $409
	—N/a	US $384
	2.1	4.9	1.6	3.6	UHD 770	300–1500	65 W	180 W	January 2022	US $339
	—N/a	US $314
	1.4	4.7	1.0	3.4	UHD 770	300–1500	35 W	106 W	US $339
Core i5		6 (12)	3.7	4.9	2.8	3.6	300–1450	20 MB	125 W	150 W	November 2021	US $289
	—N/a	US $264
	3.3	4.8	—N/a	UHD 770	300–1450	18 MB	65 W	117 W	January 2022	US $223
	2.1	4.6	35 W	74 W
	3.0	65 W	117 W	US $202
	2.0	4.4	35 W	74 W
12490F	3.0	4.6	—N/a	20 MB	65 W	117 W	February 2022	CN ¥1599
	2.5	4.4	UHD 730	300–1450	18 MB	January 2022	US $202
	—N/a	US $192
	1.8	4.2	UHD 730	350–1450	35 W	74 W	US $202
Core i3		4 (8)	3.5	4.4	12 MB	60 W	89 W	US $143
	2.3	4.2	35 W	69 W
	3.3	4.3	300–1400	60 W	89 W	US $122
	—N/a	58 W	US $97
	2.2	4.1	UHD 730	300–1400	35 W	69 W	US $122

Core i (13th gen)

Raptor Lake-S

Common features of Core i (13th gen) desktop processors:

Socket: LGA 1700.
Supported chipsets: B660, B760, H610, H670, H710, H770, Q670E, R680E, W680, Z690, Z790.
All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache: P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache: P-cores: 2 MB per core on i5-13600K/KF and above models, 1.25 MB per core on 13600 and below models. E-cores: 4 MB per E-core cluster on i5-13600K/KF and above models, 2 MB per cluster on 13600 and below models (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)	E-core (efficiency)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Cores (Threads)	Clock rate (GHz)	Cores (Threads)	Clock rate (GHz)	Model	Clock (MHz)	Base	Max. Turbo
Base	Turbo	TVB	Base	Turbo
Core i9		8 (16)	3.2	5.8	6.0	16 (16)	2.4	4.3	UHD 770	300–1650	36 MB	150 W	253 W	January 2023	US $689
	3.0	5.7	5.8	2.2	125 W	October 2022	US $589
	—N/a	US $564
	2.0	5.5	5.6	1.5	4.2	UHD 770	300–1650	65 W	219 W	January 2023	US $549
	—N/a	US $524
	1.1	5.3	—N/a	0.8	3.9	UHD 770	300–1650	35 W	106 W	US $549
Core i7		2.1	5.2	8 (8)	1.5	4.1	—N/a	33 MB	65 W	219 W	February 2023	CN ¥2999
	3.4	5.4	2.5	4.2	UHD 770	300–1600	30 MB	125 W	253 W	October 2022	US $409
	—N/a	US $384
	2.1	5.2	1.5	4.1	UHD 770	300–1600	65 W	219 W	January 2023
	—N/a	US $359
	1.4	4.9	1.0	3.6	UHD 770	300–1600	35 W	106 W	US $384
Core i5		6 (12)	3.5	5.1	2.6	3.9	300–1500	24 MB	125 W	181 W	October 2022	US $319
	—N/a	US $294
	2.7	5.0	2.0	3.7	UHD 770	300–1550	65 W	154 W	January 2023	US $255
	1.8	4.8	1.3	3.4	35 W	92 W
	2.5	1.8	3.5	65 W	154 W	US $232
	1.6	4.6	1.2	3.2	35 W	92 W
	2.5	4.8	4 (4)	1.8	3.5	—N/a	65 W	148 W	February 2023	CN ¥1599
	4.6	3.3	UHD 730	300–1550	20 MB	65 W	154 W	January 2023	US $221
	—N/a	148 W	US $196
	1.3	4.4	1.0	3.0	UHD 730	300–1550	35 W	82 W	US $221
Core i3		4 (8)	3.4	4.5	—N/a	300–1500	12 MB	60 W	89 W	US $134
	—N/a	US $109
	2.5	4.2	UHD 730	300–1500	35 W	69 W	US $134

Core i (14th gen)

Raptor Lake-S Refresh

Common features of Core i (14th gen) desktop processors:

Socket: LGA 1700.
Supported chipsets: B660, B760, H610, H670, H710, H770, Q670E, R680E, W680, Z690, Z790.
All the CPUs support dual-channel DDR4-3200 or DDR5-5600 RAM.
All the CPUs provide 16 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache: P-cores: 80 KB (48 KB data + 32 KB instructions) per core. E-cores: 96 KB (64 KB data + 32 KB instructions) per core.
L2 cache: P-cores: 2 MB per core on i5-14600/T/K/KF and above models, 1.25 MB per core on 14500 and below models. E-cores: 4 MB per E-core cluster on i5-14600/T/K/KF and above models, 2 MB per cluster on 14500 and below models (each "cluster" contains four cores).
Fabrication process: Intel 7.
K-suffix processors have an unlocked multiplier and can be overclocked.
i9 and i7 models support Turbo Boost 3.0 on the P-cores, while i5 only support Turbo Boost 2.0. The turbo clock speeds shown are of the highest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)	E-core (efficiency)	Integrated GPU	Smart Cache	TDP	Release date	MSRP
Cores (Threads)	Clock rate (GHz)	Cores (Threads)	Clock rate (GHz)	Model	Clock (MHz)	Base	Max. Turbo
Base	Turbo	TVB	Base	Turbo
Core i9		8 (16)	3.2	5.9	6.2	16 (16)	2.4	4.5	UHD 770	300–1650	36 MB	150 W	253 W	March 2024	US $689
	5.8	6.0	4.4	125 W	October 2023	US $589
	—N/a	US $564
	2.0	5.6	5.8	1.5	4.3	UHD 770	300–1650	65 W	219 W	January 2024	US $549
	—N/a	US $524
	1.1	5.5	—N/a	0.9	3.7	UHD 770	300–1650	35 W	106 W	US $549
Core i7		2.1	5.4	8 (8)	1.5	4.2	—N/a	65 W	219 W	China only
	3.4	5.6	12 (12)	2.5	4.3	UHD 770	300–1600	33 MB	125 W	253 W	October 2023	US $409
	—N/a	US $384
	2.1	5.4	1.5	4.2	UHD 770	300–1600	65 W	219 W	January 2024
	—N/a	US $359
	1.3	5.2	0.9	3.7	UHD 770	300–1600	35 W	106 W	US $384
Core i5		6 (12)	3.5	5.3	8 (8)	2.6	4.0	300–1550	24 MB	125 W	181 W	October 2023	US $319
	—N/a	US $294
	2.7	5.2	2.0	3.9	UHD 770	300–1550	65 W	154 W	January 2024	US $255
	1.8	5.1	1.3	3.6	35 W	92 W
	2.6	5.0	1.9	3.7	65 W	154 W	US $232
	1.7	4.8	1.2	3.4	35 W	92 W
	2.8	4.9	4 (4)	2.1	3.7	—N/a	65 W	148 W	China only
	2.5	4.7	1.8	3.5	UHD 730	300–1550	20 MB	US $221
	—N/a	US $196
	1.5	4.5	1.1	3.2	UHD 730	300–1550	35 W	82 W	US $221
Core i3		4 (8)	3.5	4.7	—N/a	300–1500	12 MB	60 W	110 W	US $134
	—N/a	US $109
	2.7	4.4	UHD 730	300–1500	35 W	69 W	US $134

Core Ultra (Series 2)

Arrow Lake-S

Common features of Core Ultra (Series 2) desktop processors:

Socket: LGA 1851.
Supported chipsets: B860, H810, Q870, Z890.
All the CPUs support up to dual-channel DDR5-5600 (UDIMM) or DDR5-6400 (CUDIMM) RAM. Additionaly Plus models support up to dual-channel DDR5-7200.
All the CPUs provide 20 lanes of PCIe 5.0 and 4 lanes of PCIe 4.0, but support may vary depending on motherboard and chipsets.
All CPUs feature a DMI 4.0 8-lane bus to the chipset (PCH).
L1 cache: P-cores: 112 KB (48 KB (12-way) data + 64 KB (16-Way) instructions) per core. E-cores: 96 KB (32 KB (8-way) data + 64 KB (16-Way) instructions) per core.
L2 cache: P-cores: 3 MB (12-Way) per core. E-cores: 4 MB (16-Way) per E-core cluster (each "cluster" contains four cores).
Fabrication process: Compute Tile (Contains the CPU cores) TSMC's N3B node.
K-suffix processors have an unlocked multiplier and can be overclocked.
Core Ultra 9 and Core Ultra 7 models support Turbo Boost 3.0 on the P-cores, while Core Ultra 5 models only support Turbo Boost 2.0. The turbo clock speeds shown are of the fastest turbo boost version supported by the processor.

Processor branding	Model	P-core (performance)	E-core (efficiency)	Integrated GPU	Smart Cache	NPU (TOPS)	TDP	Release date	MSRP
Cores (Threads)	Clock rate (GHz)	Cores (Threads)	Clock rate (GHz)	Model	Clock (MHz)	Base	Max. Turbo
Base	Turbo	TVB	Base	Turbo
Core Ultra 9		8 (8)	3.7	5.6	5.7	16 (16)	3.2	4.6	Intel Graphics (4 Xe-cores)	300–2000	36 MB	13	125 W	250 W	October 2024	US $589
	2.5	5.5	5.6	1.9	65 W	182 W	January 2025	US $549
	1.4	5.4	—N/a	1.2	35 W	112 W
Core Ultra 7		3.7	5.5	3.2	4.7	125 W	250 W	March 2026	US $299
	3.9	12 (12)	3.3	4.6	30 MB	125 W	250 W	October 2024	US $394
	—N/a	US $379
	2.4	5.3	1.8	Intel Graphics (4 Xe-cores)	300–1950	65 W	182 W	January 2025	US $384
	—N/a	US $369
	1.5	1.2	Intel Graphics (4 Xe-cores)	300–1950	35 W	112 W	US $384
Core Ultra 5		6 (6)	4.2	3.3	300–1900	125 W	159 W	March 2026	US $199
	—N/a	US $184
	5.2	8 (8)	3.6	Intel Graphics (4 Xe-cores)	300–1900	24 MB	October 2024	US $309
	—N/a	US $294
	3.5	5.1	3.0	4.5	Intel Graphics (4 Xe-cores)	300–1900	65 W	121 W	January 2025	US $270
	2.2	1.7	35 W	114 W
	3.4	5.0	2.9	4.4	Intel Graphics (3 Xe-cores)	300–2000	65 W	121 W	US $247
	2.2	1.6	35 W	114 W
	3.3	4.9	4 (4)	2.7	Intel Graphics (2 Xe-cores)	300–1800	20 MB	65 W	121 W	US $236
	—N/a	US $221
	2.5	1.9	Intel Graphics (2 Xe-cores)	300–1800	35 W	114 W	US $236

Mobile processors

Release timelineMobile processors
2014
2009	Nehalem microarchitecture (1st generation)
2010	Westmere microarchitecture (1st generation)
2011	Sandy Bridge microarchitecture (2nd generation)
2012	Ivy Bridge microarchitecture (3rd generation)
2013	Haswell microarchitecture (4th generation)
2015	Broadwell microarchitecture (5th generation)
Skylake microarchitecture (6th generation)
2016
2017	Kaby Lake microarchitecture (7th/8th generation)
2018	Coffee Lake microarchitecture (8th generation)
2019	Comet Lake microarchitecture (10th generation)
Ice Lake (10th generation)
2020	Tiger Lake (11th generation)
2021
2022	Alder Lake (12th generation)
2023	Raptor Lake (13th generation)
Raptor Lake (14th generation)
Meteor Lake (Ultra Series 1)
2024	Lunar Lake (Ultra Series 2)
Raptor Lake (Ultra Series 2)
2025	Arrow Lake (Ultra Series 2)

Core

Yonah

Model	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Release price (USD)
	1.07 GHz	2 MB	533 MT/s	8×	0.95–1.05 V	5.5 W	Socket 479/FC-μBGA	April 2006	$241
	1.2 GHz	2 MB	533 MT/s	9×	0.95–1.05 V	5.5 W	Socket 479/FC-μBGA	April 2006	$262
	1.33 GHz	2 MB	533 MT/s	10×	0.85–1.1 V	5.5 W	Socket 479/FC-μBGA	January 2007	$262
	1.07 GHz	2 MB	533 MT/s	8×	0.8–1.1 V	9 W	Socket 479/FC-μBGA	June 2006	$262
	1.2 GHz	2 MB	533 MT/s	9×	0.8–1.1 V	9 W	Socket 479/FC-μBGA	June 2006	$289
	1.5 GHz	2 MB	667 MT/s	9×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	January 2006	$284
	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	January 2006	$316
	1.83 GHz	2 MB	667 MT/s	11×	0.762–1.212 V	15 W	Socket 479/FC-μBGA	September 2006	$316
Core Solo T1200	1.5 GHz	2 MB	667 MT/s	9×	0.7625–1.3 V	27 W	Socket M	July 2006
	1.73 GHz	2 MB	533 MT/s	13×	0.7625–1.3 V	31 W	Socket M
	1.67 GHz	2 MB	667 MT/s	10×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket 479/FC-μBGA Socket M Socket M	January 2006	$209
	1.87 GHz	2 MB	533 MT/s	14×	0.7625–1.3 V	31 W	Socket M	July 2006
	1.83 GHz	2 MB	667 MT/s	11×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket 479/FC-μBGA Socket M Socket M	May 2006	$209
Core Solo T1500	2 GHz	2 MB	667 MT/s	12×	0.7625–1.3 V	27 W	Socket 479/FC-μBGA Socket M	August 2006
	1.6 GHz	2 MB	533 MT/s	12×	0.762–1.3 V	31 W	Socket M	May 2006	$140
	1.73 GHz	2 MB	533 MT/s	13×	0.762–1.3 V	31 W	Socket M	May 2006	OEM
	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$241
	1.67 GHz	2 MB	667 MT/s	10×	0.762–1.3 V	31 W	Socket M Socket M μFCBGA-479 μFCBGA-479	May 2006	$209
	1.87 GHz	2 MB	533 MT/s	14×	0.762–1.3 V	31 W	Socket M		OEM
	1.83 GHz	2 MB	667 MT/s	11×	0.762–1.3 V	31 W 31 W 27 W 27 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$294
	2 GHz	2 MB	533 MT/s	15×	0.762–1.3 V	31 W	Socket M		OEM
	2 GHz	2 MB	667 MT/s	12×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$423
	2.17 GHz	2 MB	667 MT/s	13×	0.762–1.3 V	31 W	Socket M Socket M Socket 479/FC-μBGA Socket 479/FC-μBGA	January 2006	$637
	2.33 GHz	2 MB	667 MT/s	14×	0.762–1.3 V	31 W	Socket M Socket 479/FC-μBGA	June 2006	$637

Core 2

Inside of old Sony VAIO laptop (VGN-C140G)

"Merom-L" (65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Die size: 81 mm2
Steppings: A1

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
ultra-low voltage
	SLAGM (A1)	1	1.07 GHz	1 MB	533 MT/s	8×	0.86–0.975 V	5.5 W	Micro-FCBGA	September 2007	LE80537UE0041M	$241
	SLAGL (A1)	1	1.2 GHz	1 MB	533 MT/s	9×	0.86–0.975 V	5.5 W	Micro-FCBGA	September 2007	LE80537UE0091M	$262

"Merom", "Merom-2M" (standard-voltage, 65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2)
Model T7600G features an unlocked clock multiplier. Only sold OEM in the Dell XPS M1710.
Intel VT-x: Supported by T5500 (L2), T5600 and all T7xxx
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2, M0 Steppings
Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
Die size: 143 mm2 (Merom), 111 mm2 (Merom-2M)
Steppings: B2, E1, G0, G2 (Merom), L2, M0 (Merom-2M)
All models of stepping B2 released in July 2006, stepping L2 released in January 2007.

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SL9VP (B2)	2	1.6 GHz	2 MB	533 MT/s	12×	0.95–1.175 V	34 W	Socket M	October 2006	LF80537GE0252M	OEM
	SLA9S (M0)	2	1.5 GHz	2 MB	667 MT/s	9×	0.95–1.175 V	35 W	Socket P	Q2 2007	LF80537GF0212M	OEM
	SLALK (M0)	2	1.4 GHz	2 MB	800 MT/s	7×	0.95–1.175 V	35 W	Socket P	October 2007	LF80537GG0172M	OEM
	SL9WE (L2)	2	1.73 GHz	2 MB	533 MT/s	13×	0.95–1.175 V	34 W	Socket M	Q1 2007	LF80537GE0302M	OEM
	SLA4F (M0)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	35 W	Socket P	Q2 2007	LF80537GF0282MT	OEM
	SLAEB (M0)	2	1.6 GHz	2 MB	800 MT/s	8×	0.95–1.175 V	35 W	Socket P	July 2007	LF80537GG0252M	OEM
	SL9SH (B2) SLGFK (G2) SL9U4 (L2)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	34 W	Socket M	August 28, 2006	LF80537GF0282M	$209
	SL9SQ (B2) SL9U8 (L2)	2	1.67 GHz	2 MB	667 MT/s	10×	0.95–1.175 V	34 W	BGA479	August 2006	LE80537GF0282M	$209
	SLA4E (M0)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	35 W	Socket P	January 2008	LF80537GF0342MT	OEM
	SL9SG (B2) SL9U3 (L2)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0342M	$241
	SL9SP (B2) SL9U7 (L2)	2	1.83 GHz	2 MB	667 MT/s	11×	0.95–1.175 V	34 W	BGA479	August 2006	LE80537GF0342M	$241
	SLAJ5 (M0)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	Socket P	Q2 2008	LF80537GG0332MN	OEM
	SLA4D (M0)	2	2 GHz	2 MB	667 MT/s	12×	0.95–1.175 V	35 W	Socket P	January 2008	LF80537GF0412M	OEM
	SLB6E (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	Q4 2008	LF80537GG041F	OEM
Core 2 Duo T5850	SLA4C (M0)	2	2.17 GHz	2 MB	667 MT/s	13×	0.95–1.175 V	35 W	Socket P	Q4 2008	LF80537GF0482M	OEM
	SLAZR (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	2008	LF80537GG0412MN	OEM
Core 2 Duo T5900	SLB6D (M0)	2	2.2 GHz	2 MB	800 MT/s	11×	0.95–1.175 V	35 W	Socket P	July 2008	LF80537GG049F	OEM
	SLA4A (M0)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0332M	$209
	SLA3U (M1)	2	1.8 GHz	2 MB	800 MT/s	9×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0332M	$209
	SL9SF (B2)	2	2 GHz	4 MB	667 MT/s	12×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0414M	$294
	SL9SL (B2)	2	2 GHz	4 MB	667 MT/s	12×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0414M	$294
	SLA49 (M0) SLAXH (M0)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	September 2007	LF80537GG0412M	$290
	SLA3T (M1)	2	2 GHz	2 MB	800 MT/s	10×	0.95–1.175 V	35 W	FCBGA6	September 2007	LE80537GG0412M	$290
	SLAMD (G0) SLA45 (E1)	2	2 GHz	4 MB	800 MT/s	10×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0414M LF80537GG0414M	$241
	SLA3P (E1) SLAMF (G0)	2	2 GHz	4 MB	800 MT/s	10×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0414M	$241
	SL9SE (B2) SLGFJ (G2)	2	2.17 GHz	4 MB	667 MT/s	13×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0484M	$423
	SL9SK (B2) SLGFV (G2)	2	2.17 GHz	4 MB	667 MT/s	13×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0484M	$423
	SLA44 (E1) SLAF8 (G0)	2	2.2 GHz	4 MB	800 MT/s	11×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0494M	$316
	SLA3N (E1) SLADM (G0)	2	2.2 GHz	4 MB	800 MT/s	11×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0494M	$316
	SL9SD (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	Socket M	August 2006	LF80537GF0534M	$637
	SL9SJ (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	FCBGA6	August 2006	LE80537GF0534M	$637
Core 2 Duo T7600G	SL9U5 (B2)	2	2.33 GHz	4 MB	667 MT/s	14×	0.95–1.175 V	34 W	Socket M	December 2006	LF80537GF0534MU
	SLA43 (E1) SLAF7 (G0)	2	2.4 GHz	4 MB	800 MT/s	12×	0.95–1.175 V	35 W	Socket P	May 2007	LF80537GG0564M	$530
	SLA3M (E1) SLADL (G0)	2	2.4 GHz	4 MB	800 MT/s	12×	0.95–1.175 V	35 W	FCBGA6	May 2007	LE80537GG0564M	$530
	SLAF6 (G0)	2	2.6 GHz	4 MB	800 MT/s	13×	0.95–1.175 V	35 W	Socket P	September 2007	LF80537GG0644ML	$530
	SLA75 (G0)	2	2.6 GHz	4 MB	800 MT/s	13×	0.95–1.175 V	35 W	FCBGA6	September 2007	LE80537GG0644M	$530

See also: Versions of the same Merom-2M core with half the L2 cache disabled are available under the Pentium Dual-Core brand.

"Merom" (low-voltage, 65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Intel Dynamic Front Side Bus Frequency Switching: Supported by E1, G0, G2 Steppings
Die size: 143 mm2
Steppings: B2, E1, G0, G2

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Core 2 Duo SL7100	SLAJD SLAT4	2	1.2 GHz	4 MB	800 MT/s	6×		12 W	μFC-BGA 956		SY80537LG0094M	OEM
	SL9SN (B2)	2	1.33 GHz	4 MB	667 MT/s	8×	0.9–1.2 V	17 W	FCBGA6	Q1 2007	LE80537LF0144M	$284
	SLA3S (E1)	2	1.4 GHz	4 MB	800 MT/s	7×	0.9–1.1 V	17 W	FCBGA6	May 2007	LE80537LG0174M	$284
	SL9SM (B2) SLGFX (G2)	2	1.5 GHz	4 MB	667 MT/s	9×	0.9–1.2 V	17 W	FCBGA6	Q1 2007	LE80537LF0214M	$316
	SLA3R (E1) SLAET (G0)	2	1.6 GHz	4 MB	800 MT/s	8×	0.9–1.1 V	17 W	FCBGA6	May 2007	LE80537LG0254M	$316
Core 2 Duo SP7500[failed verification]	SLAT2 SLAEV	2	1.6 GHz	4 MB	800 MT/s	8×	1.0–1.25 V	20 W	μFC-BGA 956		SY80537GG0254M	OEM
	SLAES (G0)	2	1.8 GHz	4 MB	800 MT/s	9×	0.9–1.1 V	17 W	FCBGA6	September 2007	LE80537LG0334M	$316
Core 2 Duo SP7700[failed verification]	SLALQ SLALR SLASZ	2	1.8 GHz	4 MB	800 MT/s	9×	1.0–1.25 V	20 W	μFC-BGA 956		SY80537GG0334M SY80537GG0334ML	OEM

"Merom-2M" (ultra-low-voltage, 65 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x
Die size: 111 mm2
Steppings: L2, M0

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLA2V (L2) SLAUT (M0)	2	1.07 GHz	2 MB	533 MT/s	8×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	April 2007	LE80537UE0042M	$262
SLV3X (M0)	2	1.07 GHz	2 MB	533 MT/s	8×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	February 2008	LE80537UE0042ML	$262
SLA2U (L2) SLAUS (M0)	2	1.2 GHz	2 MB	533 MT/s	9×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	April 2007	LE80537UE0092M	$289
SLV3W (M0)	2	1.2 GHz	2 MB	533 MT/s	9×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	April 2007	LE80537UE0092ML	$289
SLA6X (L2) SLAUR (M0)	2	1.33 GHz	2 MB	533 MT/s	10×	0.8–0.975 V	10 W	FCBGA6 (Socket M)	December 2007	LE80537UE0142M	$289
SLV3V (M0)	2	1.33 GHz	2 MB	533 MT/s	10×	0.8–0.975 V	10 W	FCBGA6 (Socket P)	February 2008	LE80537UE0142ML	$289

"Merom XE" (65 nm)

These models feature an unlocked clock multiplier

All models support: MMX, SSE, SSE2, SSE3, SSSE3, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Front Side Bus Frequency Switching
Merom XE processors support Dynamic Front Side Bus Throttling between 400 and 800 MT/s.
Die size: 143 mm2
Steppings: E1, G0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SLA6Z (E1)	2	2.6 GHz	4 MB	800 MT/s	13×	1.0375–1.3 V	44 W	Socket P	July 2007	LF80537GG0644M	$851
	SLA33 (E1) SLAF4 (G0)	2	2.8 GHz	4 MB	800 MT/s	14×	1.0375–1.3 V	44 W	Socket P	August 2007	LF80537GG0724M	$851

"Penryn-L" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Socket P processors can throttle the front-side bus (FSB) anywhere between 400 and 800 MT/s as needed.
Die size: 82 mm2
228 million transistors
Package size: 22 mm × 22 mm
Steppings: M0, R0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
Small Form Factor, ultra-low voltage
	SLGAR (M0) SLGAJ (R0)	1	1.2 GHz	3 MB	800 MT/s	6×	1.05–1.15 V	5.5 W	μFC-BGA 956	May 2008	AV80585UG0093M	$262
	SLGFM (R0)	1	1.4 GHz	3 MB	800 MT/s	7×	1.05–1.15 V	5.5 W	μFC-BGA 956	Q2 2009	AV80585UG0173M	$262

"Penryn" (Apple iMac specific, 45 nm)

Die size: 107 mm2
The 2008 20" iMac used the E8135 and E8335 CPUs at a lower than specified clock frequency, explaining why the same model is used at different frequencies. This list shows the frequencies used by Apple.
Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)
Core 2 Duo E8135	SLAQA (C0)	2	2.4 GHz	6 MB	1066 MT/s	9×		44 W	Socket P	April 2008	FF80576E8135 FF80576GH0676M
Core 2 Duo E8135	SLG8W (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×		44 W	Socket P	March 2009	AW80576GH0676M AW80576E8135
Core 2 Duo E8135	SLGED (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×		35 W	Socket P	March 2009	AW80576GH0676M
Core 2 Duo E8235	SLAQB (C0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×		44 W	Socket P	April 2008	FF80576GH0726M
Core 2 Duo E8335	SLAQC (C0)	2	2.93 GHz	6 MB	1066 MT/s	11×		44 W	Socket P	April 2008	FF80576GH0776M
Core 2 Duo E8335	SLGEB (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.0500–1.2250 V	35 W	Socket P	March 2009	AW80576GH0776M
Core 2 Duo E8435	SLAQD (C0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.0500–1.2375 V	55 W	Socket P	April 2008	FF80576GH0836M
Core 2 Duo E8435	SLGEA (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×		44 W	Socket P	March 2009	AW80576GH0836M

"Penryn", "Penryn-3M" (standard-voltage, 45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel Dynamic Acceleration (IDA)
T6570, T6670, all T8xxx and T9xxx models support Intel VT-x
All T9xxx models support Trusted Execution Technology (TXT)
T6xxx models are Penryn-3M processors with 1 MB L2 cache disabled.

Note that models T8100, T8300, T9300, T9500 are Penryn processors designed for Santa Rosa Refresh platforms with maximum FSB of 800 MT/s, whereas the rest of the Penryn processors are designed for Montevina platforms that can go up to maximum FSB of 1066 MT/s.

Penryn processors support Dynamic Front Side Bus Throttling between 400–800MT/s.

Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M)
Steppings: C0, E0 (Penryn) M0, R0 (Penryn-3M)

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SLGJ4 (R0)	2	2 GHz	2 MB	800 MT/s	10×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0412MA	OEM
	SLGF4 (R0)	2	2.1 GHz	2 MB	800 MT/s	10.5×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0452ML AW80577GG0452MA	OEM
	SLGLL (R0)	2	2.1 GHz	2 MB	800 MT/s	10.5×	1.00–1.250 V	35 W	Socket P	Q3 2009	AW80577GG0452MH	OEM
	SLGJ9 (R0) SLGF5 (R0)	2	2.2 GHz	2 MB	800 MT/s	11×	1.00–1.250 V	35 W	Socket P	January 2009	AW80577GG0492MA AW80577GG0492ML	OEM
	SLGLK (R0) SLGLJ (R0)	2	2.2 GHz	2 MB	800 MT/s	11×	1.00–1.250 V	35 W	Socket P	Q3 2009	AW80577GG0492MH	OEM
Core 2 Duo T6900	SLGHZ (?)	2	2.5 GHz	2 MB	800 MT/s	12.5×	1.00–1.250 V	35 W	Socket P	?	AW80577GG0602MA	OEM
Core 2 Duo T6970	SLGLJ (R0)	2	2.5 GHz	2 MB	800 MT/s	12.5×	1.00–1.250 V	35 W	Socket P	?	AW80577GG0602MH	OEM
	SLAP9 (M0) SLAVJ (M0) SLAYP (M0) SLAYZ (C0) SLAUU (C0)	2	2.1 GHz	3 MB	800 MT/s	10.5×	1.000–1.250 V	35 W	Socket P	January 2008	FF80577GG0453M (M0) FF80577GG0453MN FF80576GG0453M (C0) BX80577T8100	$209
	SLAPS (M0) SLAXG (M0) SLAPT (C0) SLAZD (C0)	2	2.1 GHz	3 MB	800 MT/s	10.5×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80577GG0453M (M0) EC80576GG0453M (C0)	$209
	SLAPA (M0) SLAYQ (M0)	2	2.4 GHz	3 MB	800 MT/s	12×	1.00–1.250 V	35 W	Socket P	January 2008	FF80577GG0563M BX80577T8300	$241
	SLAPR (M0) SLAPU (C0) SLAZC (C0)	2	2.4 GHz	3 MB	800 MT/s	12×	1.00–1.250 V	35 W	FCBGA6	January 2008	EC80577GG0563M (M0) EC80576GG0563M (C0)	$241
	SLAQG (C0) SLAYY (C0)	2	2.5 GHz	6 MB	800 MT/s	12.5×	1.000–1.250 V	35 W	Socket P	January 2008	FF80576GG0606M	$316
	SLAPV (C0) SLAZB (C0)	2	2.5 GHz	6 MB	800 MT/s	12.5×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80576GG0606M	$316
	SLB46 (C0) SLB4D (C0) SLGE5 (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.050–1.162 V	35 W	Socket P	July 2008	AW80576GH0616M	$316
	SL3BX (C0) SLGEK (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.050–1.162 V	35 W	FCBGA6	July 2008	AV80576GH0616M	$316
	SLAQH (C0) SLAYX (C0)	2	2.6 GHz	6 MB	800 MT/s	13×	1.000–1.250 V	35 W	Socket P	January 2008	FF80576GG0646M	$530
	SLAPW (C0) SLAZA (C0) SLB49 (C0) SLB4A (C0)	2	2.6 GHz	6 MB	800 MT/s	13×	1.000–1.250 V	35 W	FCBGA6	January 2008	EC80576GG0646M AV80576SH0616M	$530
	SLGE4 (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.050–1.212 V	35 W	Socket P	December 2008	AW80576GH0676MG	$316
	SLGEL (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.050–1.212 V	35 W	FCBGA6	December 2008	AV80576GH0676MG	$316
	SLB47 (C0) SLG8N (C0) SLG9F (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.050–1.162 V	35 W	Socket P	July 2008	AW80576GH0726M	$530
	SLB43 (C0) SLGEM (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.050–1.162 V	35 W	FCBGA6	July 2008	AV80576GH0726M	$530
	SLGES (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.050–1.212 V	35 W	Socket P	December 2008	AW80576GH0776MG	$530
	SLGEP (E0)	2	2.93 GHz	6 MB	1066 MT/s	11×	1.050–1.212 V	35 W	FCBGA6	December 2008	AV80576GH0776MG	$530
	SLGEE (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.050–1.2125 V	35 W	Socket P	April 2009	AW80576GH0836MG	$530
	SLGKH (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.050–1.2125 V	35 W	FCBGA6	April 2009	AV80576GH0836MG	$530

"Penryn", "Penryn-3M" (medium-voltage, 45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x (except the non-Mac P7350, P7450), Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Select Apple subsets of P7000 series processors support Intel VT-x.
Penryn and Penryn-3M processors support Dynamic Front Side Bus Throttling between 533–1066MT/s.
Die size: 107 mm2 (Penryn), 82 mm2 (Penryn-3M)
Package size: 35 mm × 35 mm
Transistors: 410 million
Steppings: (Core microarchitecture 45nm steppings) C0, E0 (Penryn) M0, R0 (Penryn-3M) stepping C0/M0 is only used in the Intel Mobile 965 Express (Santa Rosa refresh) platform stepping E0/R0 adds two new instructions (XSAVE/XRSTOR) and supports the later Intel Mobile 4 Express (Montevina) platform

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLB44 (C0) SLB53 (M0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	Socket P	Mid 2008	AW80576GH0413M AW80577SH0413M	OEM
SLG8E (C0) SLGE3 (R0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	FC-BGA478	Mid 2008		OEM
SLG8X (R0) SLGF9 (R0)	2	2 GHz	3 MB	1066 MT/s	7.5×	1.00–1.250 V	25 W	Socket P	January 2009	AW80577SH0413M AW80577SH0413ML	OEM
SLB45 (C0) SLGF7 (R0) SLB54 (M0) SLB56 (M0)	2	2.13 GHz	3 MB	1066 MT/s	8×	1.00–1.250 V	25 W	Socket P	January 2009	AW80577SH0463M AW80576GH0463M (C0)	OEM
SLGFF (C0)	2	2.13 GHz	3 MB	1066 MT/s	8×	1.00–1.250 V	25 W	FC-BGA478	January 2009	AW80577P7450M (C0)	OEM
SLGF8 (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	June 2009	AW80577SH0513MA	OEM
SLGLW (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	Q3 2009	AW80577SH0513ML	OEM
SLB3R (M0) SLB3Q (M0) SLB52 (M0) SLG8Z (M0) SLGCC (R0) SLGCQ (R0) SLGCF (R0) SLGFC (R0) SLGCL (R0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	Socket P	June 13, 2008	AW80577SH0513M AW80577SH0513MN BX80577P8400	$209
SLB4M (M0)	2	2.27 GHz	3 MB	1066 MT/s	8.5×	1.00–1.250 V	25 W	FC-BGA478	June 2008	AV80577SH0513M	$209
SLB3S (M0) SLGA4 (M0) SLGFD (R0)	2	2.4 GHz	3 MB	1066 MT/s	9×	1.00–1.250 V	25 W	Socket P	June 2008	AW80577SH0563M BX80577P8600	$241
SLB4N (M0) SLGDZ (R0)	2	2.4 GHz	3 MB	1066 MT/s	9×	1.00–1.250 V	25 W	FC-BGA478	June 2008	AV80577SH0563M	$241
SLGFE (R0)	2	2.53 GHz	3 MB	1066 MT/s	9.5×	1.00–1.250 V	25 W	Socket P	December 2008	AW80577SH0613MG BX80577P8700	$241
SLGFG (R0)	2	2.53 GHz	3 MB	1066 MT/s	9.5×	1.00–1.250 V	25 W	FC-BGA478	December 2008	AV80577SH0613MG	$241
SLGLR (R0)	2	2.67 GHz	3 MB	1066 MT/s	10×	1.00–1.250 V	25 W	Socket P	Q2 2009	AW80577SH0673MG BX80577P8800	$241
SLGLA (E0)	2	2.67 GHz	3 MB	1066 MT/s	10×	1.00–1.250 V	25 W	FC-BGA478	Q2 2009	AV80577SH0673MG	$241
SLB4E (C0) SLGE8 (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	1.05–1.162 V	25 W	Socket P	July 2008	AW80576SH0616M AV80576SH0616M	$348
SLGE6 (E0)	2	2.67 GHz	6 MB	1066 MT/s	10×	1.05–1.212 V	25 W	Socket P	December 2008	AW80576SH0676MG	$348
SLGQS (E0)	2	2.8 GHz	6 MB	1066 MT/s	10.5×	1.012–1.175 V	28 W	Socket P	June 2009	AW80576SH0726MG	$348

"Penryn" (medium-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Die size: 107 mm2
Package size: 22 mm × 22 mm
Steppings: C0, E0

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLB63 (C0)	2	2.27 GHz	6 MB	1066 MT/s	8.5×	0.900–1.225 V	25 W	μFC-BGA 956	July 2008	AV80576SH0516M	$284
SLB64 (C0) SLGHG (C0) SLGAA (E0)	2	2.4 GHz	6 MB	1066 MT/s	9×	0.900–1.225 V	25 W	μFC-BGA 956	July 2008	AV80576SH0566M	$284
SLGER (E0)	2	2.53 GHz	6 MB	1066 MT/s	9.5×	0.900–1.225 V	25 W	μFC-BGA 956	Q1 2009	AV80576SH0516M AV80576SH0616M	$316

"Penryn" (low-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT), Intel Dynamic Acceleration (IDA)
Die size: 107 mm2
Package size: 22 mm × 22 mm
Steppings: C0, E0

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLB65 (C0) SLGHC (C0) SLGAG (E0)	2	1.6 GHz	6 MB	1066 MT/s	6×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LH0256M	$284
SLGA2 (C0) SLGAD (E0)	2	1.8 GHz	6 MB	800 MT/s	9×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LG0336M	$316
SLB66 (C0) SLGHD (C0) SLGAB (E0)	2	1.87 GHz	6 MB	1066 MT/s	7×	1.050–1.150 V	17 W	μFC-BGA 956	September 2008	AV80576LH0366M	$316
SLGEQ (E0)	2	2.13 GHz	6 MB	1066 MT/s	8×	1.050–1.150 V	17 W	μFC-BGA 956	Q1'09	AV80576LH0466M	$316

"Penryn-3M" (ultra-low-voltage, 45 nm, Small Form Factor)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT) (except SU7300), Intel Dynamic Acceleration (IDA)
Die size: 107 mm2
Package size: 22 mm × 22 mm
Steppings: M0, R0

sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
SLGS6 (R0) SLGYV (R0)	2	1.3 GHz	3 MB	800 MT/s	6.5×	1.05–1.15 V	10 W	μFC-BGA 956	September 2009	AV80577UG0133M AV80577UG0133ML	$289
SLB5Q (M0) SLGAL (R0)	2	1.2 GHz	3 MB	800 MT/s	6×	1.05–1.15 V	10 W	μFC-BGA 956	September 2008	AV80577UG0093M	$262
SLB5V (M0) SLGHN (M0) SLGAK (R0)	2	1.4 GHz	3 MB	800 MT/s	7×	1.05–1.15 V	10 W	μFC-BGA 956	September 2008	AV80577UG0173M	$289
SLGEX (R0) SLGFN (R0)	2	1.6 GHz	3 MB	800 MT/s	8×	1.05–1.15 V	10 W	μFC-BGA 956	Q1 2009	AV80577UG0253M	$289

"Penryn XE" (45 nm)

These models feature an unlocked clock multiplier
All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Penryn XE processors support Dynamic Front Side Bus Throttling between 400–800 MT/s and 533–1066 MT/s.
Die size: 107 mm2
Steppings: C0, E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SLAQJ (C0) SLAZ3 (C0)	2	2.8 GHz	6 MB	800 MT/s	14×	1.062–1.150 V	44 W	Socket P	January 2008	FF80576ZG0726M	$851
	SLB48 (C0) SLG8M (C0) SLGE7 (E0)	2	3.07 GHz	6 MB	1066 MT/s	11.5×	1.062–1.150 V	44 W	Socket P	July 2008	AW80576GH0836M	$851

"Penryn QC" (45 nm)

All models support: MMX, SSE, SSE2, SSE3, SSSE3, SSE4.1, Enhanced Intel SpeedStep Technology (EIST), Intel 64, XD bit (an NX bit implementation), Intel Active Management Technology (iAMT2), Intel VT-x, Trusted Execution Technology (TXT)
Can throttle the front-side bus (FSB) anywhere between 533 and 1066 MT/s as needed.
Die size: 2 × 107 mm2
Steppings: E0

Model	sSpec number	Cores	Clock rate	L2 cache	FSB	Mult.	Voltage	TDP	Socket	Release date	Part number(s)	Release price (USD)
	SLGEJ (E0)	4	2 GHz	2 × 3 MB	1066 MT/s	7.5×	1.050–1.175 V	45 W	Socket P	December 2008	AW80581GH0416M BX80581Q9000	$348
	SLB5G (E0)	4	2.27 GHz	2 × 6 MB	1066 MT/s	8.5×	1.050–1.175 V	45 W	Socket P	August 2008	AW80581GH051003	$851