Snapdragon
General information
Launched November 2007(18 years ago)(2007-11)
Physical specifications
Cores up to 18, as of 2025
Architecture and classification
Application Mobile SoC and 2-in-1 PC The Snapdragon is a brand of systems on chips (SoCs) designed by Qualcomm and intended for mobile computing use.
Acronyms System on chips released before the Snapdragon naming scheme are referred to only by their stock keeping unit (SKU) numbers. Some models were later given a Snapdragon product name. Earlier models are prefixed by an acronymic three-letter code; their full forms are as follows:
QSC (Qualcomm Single Chip) MSM (Mobile Station Modem) , denotes a chip with integrated cellular modem APQ (Application Processor Qualcomm) , denotes a chip without modem Model number Fab CPU GPU (or Gfx Core)Modem Sampling availability QSC1xxx QSC1100 65nm ARM926EJ-S @ 96/128 MHzNo 3D, ARM 2D CDMA2000 1xQ4 2007 QSC1110 QSC1105 ARM926EJ-S @ 211/316 MHzCDMA2000 1x, GSM (Dual-Standby)2010 QSC1215 Q3 2012 QSC6xxx QSC6010 ARM926EJ-S No 3D, ARM 2D CDMA2000 1x2006 QSC6020 QSC6030 QSC6055 65nm ARM926EJ-S @ 192 MHzQ1 2007 QSC6065 Q2 2007 QSC6075 ARM926EJ-S @ 192/312 MHzEV-DO Rel.0QSC6085 EV-DO Rel.0/Rev.AQ4 2007 QSC6155 45nm ARM1136JF-S @ 480 MHz with L2 cache Stargate 3D , ARM 2DCDMA2000 1x, GSM , GPRS 2008 QSC6165 QSC6175 EV-DO Rel.0QSC6185 EV-DO Rel.0/Rev.AQSC6195 EV-DO Rel.0/Rev.A/Rev.BQSC6240 (ESC6240) 65nm ARM926EJ-S @ 184/230 MHzNo 3D, ARM 2D GSM , GPRS , EDGE , WCDMA Q3 2007 QSC6245-1 QSC6260-1 GSM , GPRS , EDGE , WCDMA , HSDPA QSC6270 (ESC6270) QSC6295 (ESC6295) 45nm ARM1136JF-S @ 480 MHz with L2 cache Stargate 3D , ARM 2DGSM , GPRS , EDGE , WCDMA , HSPA+ 2009 QSC6695 CDMA2000 1xMSMx MSM1 800 nm 80186 (x86-16 )CDMA IS-95 A (cdmaOne )Q1 1993 MSM2 500 nm 80186 (x86-16 )1995 MSM2xxx MSM2300 80186 (x86-16 )CDMA IS-95 A/B (cdmaOne )Q1 1997 MSM2310 80186 (x86-16 )Q2 1998 MSM3xxx MSM3000 350 nm ARM7TDMI No 3D, ARM 2D CDMA IS-95 A/B (cdmaOne )Q3 1998 MSM3100 Q1 1999 MSM3300 Q1 2000 MSM5xxx MSM5000 180 nm ARM7TDMI No 3D, ARM 2D CDMA2000 1xQ3 2000 MSM5100 180 nm ARM7TDMI @ 50 MHzCDMA2000 1x, AMPS Q1 2000 MSM5105 180 nm ARM7TDMI @ 27 MHzCDMA2000 1x, AMPS Q3 2001 MSM5200 180 nm ARM7TDMI @ 50 MHzWCDMA Q4 2000 MSM5500 180 nm ARM7TDMI @ 50 MHzCDMA2000 1x, EV-DO Rel.0Q4 2000 MSM6xxx MSM6000 250 nm ARM7TDMI @ 20 MHzNo 3D, ARM 2D CDMA2000 1xQ1 2002 MSM6025 180 nm ARM7TDMI @ 40 MHzQ3 2003 MSM6050 180 nm Q1 2003 MSM6100 90 nm ARM926EJ-S @ 146 MHzARM-DSP 3D, ARM 2D Q4 2002 MSM6125 90 nm CDMA2000 1x, GSM , GPRS Q4 2005 MSM6150 130 nm ARM926EJ-S @ 225 MHzDefender2 3D , ARM 2DCDMA2000 1xQ3 2004 MSM6175 MSM6200 180 nm ARM7TDMI @ 40 MHzNo 3D, ARM 2D GSM , GPRS , EDGE , WCDMA Q3 2002 MSM6225 90 nm ARM926EJ-S @ 146 MHzGSM , GPRS , EDGE , WCDMA , HSDPA Q2 2005 MSM6250 130 nm ARM-DSP 3D, ARM 2D GSM , GPRS , EDGE , WCDMA Q3 2003 MSM6250A 90 nm ARM926EJ-S @ 180 MHzMSM6245 65 nm ARM926EJ-S @ 225 MHzNo 3D, ARM 2D Q2 2006 MSM6246 ARM926EJ-S @ 274 MHzGSM , GPRS , EDGE , WCDMA , HSDPA MSM6255A ARM926EJ-S @ 225 MHzGSM , GPRS , EDGE , WCDMA Q2 2006 MSM6260 ARM-DSP 3D, ARM 2D GSM , GPRS , EDGE , WCDMA , HSDPA MSM6275 90 nm Defender2 3D , ARM 2DQ4 2004 MSM6280 90 nm ARM926EJ-S @ 274 MHzQ3 2005 MSM6280A Stargate 3D , ARM 2D2007 MSM6290 65 nm ARM926EJ-S @ 300 MHzGSM , GPRS , EDGE , WCDMA , HSDPA , HSUPA 2009 MSM6300 90 nm ARM926EJ-S CDMA2000 1x, GSM , GPRS Q3 2002 MSM6500 130 nm ARM926EJ-S @ 146 MHzARM-DSP 3D, ARM 2D CDMA2000 1x, EV-DO Rel.0, GSM , GPRS 2006 MSM6550 ARM926EJ-S @ 225 MHzDefender2 3D , ARM 2DQ3 2004 MSM6550A 90 nm MSM6575 65 nm ARM926EJ-S @ 270 MHzDefender3 3D , ARM 2D2006 MSM6800 130 nm CDMA2000 1x, EV-DO Rel.0/Rev.A, GSM , GPRS Q2 2006 MSM6800A 90 nm 2007 MSM7xxx MSM7200 90 nm ARM1136J-S @ 400 MHzImageon 2D, 3D Q3Dimension (Adreno 130)GSM , GPRS , EDGE , WCDMA , HSDPA , HSUPA 2006 MSM7200A ARM1136J-S @ 528 MHzQ1 2007 MSM7201 90 nm ARM1136JF-S @ 528 MHz2008 MSM7201A 65 nm MSM7500 90 nm ARM1136JF-S @ 528 MHzCDMA2000 1x, EV-DO Rel.0/Rev.A2006 MSM7500A 65 nm Q4 2007 MSM7600 90 nm ARM1136J-S @ 528 MHzGSM , GPRS , EDGE , WCDMA , HSDPA , HSUPA , CDMA2000 1x,EV-DO Rel.0/Rev.AQ1 2007 MSM7600A 65 nm MSM7850 LT 3D, LT 2D CDMA2000 1x, EV-DO Rel.0/Rev.A/Rev.B2008
Snapdragon S series Snapdragon S1 Features of the Snapdragon S1 series Snapdragon S1 notable features over its predecessor (MSM7xxx): CPU features 1 core up to 1 GHz Scorpion or Cortex-A5 or ARM11 Up to 256K L2 cache Up to 32K+32K L1 cache GPU features Adreno 200 (from Software rendered or Adreno 130) OpenGL ES 1.1 OpenVG 1.0 Direct3D Mobile Unified shader model 5-way VLIW DSP features Hexagon QDSP5 at 350 MHz or Hexagon QDSP6 600 MHz ISP features Up to 12 MP camera Modem and wireless features External Bluetooth 4.0 or external Bluetooth 2.0/2.1 on some models 45 or 65 nm manufacturing technology
Model number Fab CPU (Core/Freq)GPU DSP ISP Memory technology Modem Connectivity Sampling availability MSM7225 65nm 1 core up to 528MHz ARM11 (ARMv6 ): 16K+16K L1 , no L2 cache Software- rendered 2D support (HVGA) Hexagon QDSP5 320MHzUp to 5MP camera LPDDR Single-channel 166MHz (1.33 GB/s)UMTS (HSPA ); GSM (GPRS , EDGE )Bluetooth2.1 (external BTS4025); 802.11b/g/n (external WCN1314); gpsOne Gen7; USB2.0 2007 MSM7625 CDMA (1×Rev.A, 1×EV-DO Rev.A); UMTS ; GSM MSM7227 1 core up to 800MHz ARM11 (ARMv6 ): 16K+16K L1 , 256K L2 cache Adreno 200 226 MHz (FWVGA)Up to 8 MP camera LPDDR Single-channel 166 MHz (1.33 GB/s)UMTS ; GSM Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external WCN1312); gpsOne Gen 7; USB 2.0 2008 MSM7627 CDMA , UMTS ; GSM MSM7225A 45 nm 1 core up to 800MHz Cortex-A5 (ARMv7 ): 32K+32K L1 , 256K L2 cache Adreno 200 245 MHz (HVGA)Hexagon QDSP5 350 MHzUp to 5 MP camera LPDDR Single-channel 200 MHz (1.6 GB/s)UMTS (HSDPA , HSUPA , W-CDMA ), MBMS ; GSM Bluetooth 4.0 (external WCN2243); 802.11b/g/n (external AR6003/5, WCN1314); gpsOne Gen 7; USB 2.0 Q4 2011 MSM7625A CDMA2000 (1×RTT, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS, MBMS; GSMMSM7227A 1 core up to 1.0GHz Cortex-A5 (ARMv7 ): 32K+32K L1 , 256K L2 cache Adreno 200 245 MHz (FWVGA)Up to 8 MP camera UMTS , MBMS ; GSM MSM7627A CDMA2000 , UMTS, MBMS; GSMMSM7225AB UMTS : up to 7.2 Mbit/s, MBMS ; GSM QSD8250 65 nm 1 core up to 1.0GHz Scorpion (ARMv7 ): 32K+32K L1 , 256K L2 cache Adreno 200 226 MHz (WXGA)Hexagon QDSP6 600 MHzUp to 12 MP camera LPDDR Single-channel 400 MHzUMTS , MBMS ; GSM Bluetooth 2.1 (external BTS4025); 802.11b/g/n (external AR6003); gpsOne Gen 7; USB 2.0 Q4 2008 QSD8650 CDMA2000 , UMTS, MBMS; GSM
Snapdragon S2 Features of the Snapdragon S2 series Snapdragon S2 notable features over its predecessor (Snapdragon S1): CPU feature 1 core up to 1.5 GHz Scorpion ARMv7 (from ARMv6 on some model) Up to 384K L2 GPU features Adreno 205 (from Software rendered or Adreno 200) Up to 266 MHz Up to 2 times faster than Adreno 200 up to ×2 relative performance on OpenGL ES 2.0 from Adreno 200 Up to XGA OpenGL ES 2.0 SVGT 1.2 OpenVG 1.1 Direct Draw GDI Concurrent CPU, DSP, graphics and MDP Memory features Up to LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s) DSP features Hexagon QDSP5 at 256 MHz 45 nm manufacturing technology 904 pins
Model number Fab CPU (ARMv7 )GPU DSP ISP Memory technology Modem Connectivity Sampling availability MSM7230 45nm 1 core up to 800MHz Scorpion : 32K+32K L1, 256K L2 Adreno 205 266MHz (XGA )Hexagon QDSP5 256MHzUp to 12MP camera LPDDR2 32-bit dual-channel 333 MHz (5.3 GB/s)GSM , GPRS, W-CDMA, UMTS,EDGE,MBMS, HSDPA,HSUPA,HSPA+ Bluetooth 4.0 (external WCN2243) or Bluetooth 3.0 (external QTR8x00); 802.11b/g/n (external WCN1314); gpsOne Gen 8 with Glonass; USB 2.0 Q2 2010 MSM7630 CDMA2000 (1×Adv, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A, SV-DO); UMTS, MBMS; GSM APQ8055 1 core up to 1.4GHz Scorpion : 32K+32K L1, 384K L2 —N/a MSM8255 1 core up to 1.0GHz Scorpion : 32K+32K L1, 384K L2 UMTS, MBMS; GSM MSM8655 CDMA2000,UMTS, MBMS; GSM MSM8255T 1 core up to 1.5GHz Scorpion : 32K+32K L1, 384K L2 UMTS, MBMS; GSM MSM8655T CDMA2000,UMTS, MBMS; GSM
Snapdragon S3 Features of the Snapdragon S3 series Snapdragon S3 notable features over its predecessor (Snapdragon S2): CPU feature 2 cores up to 1.7 GHz Scorpion 512 KB L2 GPU features Adreno 220 Up to 4 times faster than Adreno 200 up to ×5 relative performance on OpenGL ES 2.0 from Adreno 200 EGL 1.3 (from 1.2) 2× larger L2 cache (512 KB from 256 KB) Up to WXGA+ DSP features Hexagon QDSP6 at 400 MHz (from Hexagon QDSP5 at 256 MHz) ISP features Up to 16 MP camera (from 12 MP) 45 nm manufacturing technology
Modelnumber Fab CPU (ARMv7 )GPU DSP ISP Memory technology Modem Connectivity Sampling availability APQ8060 45nm 2 cores up to 1.7GHz Scorpion : 512KBL2 Adreno 220 266MHz (WXGA+)Hexagon QDSP6 400MHzUp to 16MP camera LPDDR2 Single- channel 333MHz (2.67GB/s)—N/a Bluetooth4.0 (external WCN2243); 802.11b/g/n (external WCN1314); gpsOneGen8 withGlonass; USB 2.0 2011 MSM8260 GSM ,GPRS ,W-CDMA , UMTS ,HSDPA,HSUPA, HSPA+,EDGE ,MBMS Q3 2010 MSM8660 CDMA2000 (1×Adv, 1×EV-DO Rel.0/Rev.A/Rev.B, 1×EV-DO MC Rev.A); UMTS ,MBMS ;GSM
Snapdragon S4 Snapdragon S4 was offered in three models: S4 Play for budget and entry-level devices, S4 Plus for mid-range devices and S4 Pro for high-end devices. It was launched in 2012. The Snapdragon S4 were succeeded by the Snapdragon 200/400 series (S4 Play) and 600/800 series (S4 Plus and S4 Pro).
Snapdragon S4 Play Model number Fab CPU (ARMv7 )GPU DSP ISP Memory technology Modem Connectivity Sampling availability MSM8225 45nm 2 cores up to 1.2GHz Cortex-A5 : 2x 32K+32K L1, 512K L2 Adreno 203 320MHz (FWVGA)Hexagon Up to 8MP camera LPDDR2 Single-channel 300MHzUMTS (HSPA ); GSM (GPRS , EDGE )Bluetooth3.0 (external); 802.11b/g/n 2.4 GHz (external); GPS: IZat Gen 7; USB 2.0 1H 2012 MSM8625 CDMA (1×Rev.A, 1×EV-DO Rev.A/B); UMTS ; GSM
Snapdragon S4 Plus Features of the Snapdragon S4 Plus series Snapdragon S4 Plus notable features over its predecessor (Snapdragon S3): CPU features 2x cores up to 1.7 GHz Krait 200 4+4 KB L0, 16+16 KB L1, 1 MB L2 Out of Order Execution (from Partial Out of Order Execution on Scorpion ) GPU features Adreno 225 Up to 1080p screen Up to 6 times faster than Adreno 200 Up to 32 ALU Direct3D feature level 9.0 (from 9.0) up to ×7.5 relative performance on OpenGL ES 2.0 from Adreno 200 Adreno 305 Up to 1080p screen (on 400 MHz) Up to 720p screen (on 320 MHz) Up to 24 ALU (from 32 on S3) Unified shader model Scalar instruction set (from unified shader model 5-way VLIW ) up to ×8 relative performance on OpenGL ES 2.0 from Adreno 200 DSP features Up to 20 MP or 13.5 MP camera ISP features Hexagon QDSP6 Modem and wireless features Integrated Bluetooth 4.0 IZat Gen8A (from IZat Gen 7) 28 nm manufacturing technology
Modelnumber Fab CPU (ARMv7 )GPU DSP ISP Memory technology Modem Connectivity Sampling availability MSM8227 28nm 2 cores up to 1.0GHz Krait : 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 305 320 MHz (FWVGA / 720p)Hexagon QDSP6Unknown LPDDR2 Single-channel 400MHzGSM(GPRS,EDGE), UMTS (DC-HSPA+, TD-SCDMA) Bluetooth4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB 2.0 2H 2012 MSM8627 CDMA (1×Rev.A, 1×EV-DO Rev.A/B, SVDO-DB); UMTS ; GSM APQ8030 2 cores up to 1.2GHz Krait : 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 305 400MHz (qHD / 1080p)Up to 13.5MP camera LPDDR2 Single-channel 533MHz—N/a . 3Q 2012 MSM8230 UMTS; GSM . MSM8630 CDMA, UMTS; GSM MSM8930 World Mode (LTEFDD/TDDCat3, SVLTE-DB, EGAL; CDMA, UMTS; GSM) APQ8060A 2 cores up to 1.5GHz Krait : 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 225 400MHz (WUXGA / 1080p)Up to 20MP camera LPDDR2 Dual-channel 500MHz—N/a . 2H 2012 MSM8260A UMTS; GSM Q1 2012 MSM8660A CDMA, UMTS; GSM MSM8960 World Mode (LTE Cat 3)
Snapdragon S4 Pro and S4 Prime (2012) Features of the Snapdragon S4 Pro series Snapdragon S4 Pro notable features over its predecessor (Snapdragon S4 Play): CPU features up to 2 cores up to 1.7 GHz Krait 200 on to Snapdragon S4 Pro up to 4 cores up to 1.5 GHz Krait 200 on to Snapdragon S4 Prime 4+4 KB L0, 16+16 KB L1, 1 MB L2 GPU features Adreno 320 Support OpenGL ES 3.0 Up to 1080p screen Up to 64 ALU (from 32 on S4 plus) up to ×23 relative performance on OpenGL ES 2.0 from Adreno 200 DSP features Hexagon QDSP6 ISP features Up to 20 MP camera Modem and wireless features LTE FDD/TDD Cat 3 or external on some models 28 nm LP manufacturing technology Up to eMMC 4.4/4.41
Modelnumber Fab CPU (ARMv7 )GPU DSP ISP Memory technology Modem Connectivity Sampling availability MSM8260A Pro 28nm (TSMC 28LP) 2 cores up to 1.7GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Adreno 320 400MHz (WUXGA / 1080p)Hexagon QDSP6Up to 20MP camera LPDDR2 Dual-channel 500MHzGSM (GPRS, EDGE), UMTS (DC-HSPA+ , TD-SCDMA) Bluetooth4.0; 802.11b/g/n (2.4/5 GHz); GPS: IZat Gen8A; USB2.0 MSM8960T World Mode (LTEFDD/TDDCat3, SVLTE-DB, EGAL; CDMA: 1×Adv., 1× EV-DO Rev.A/B; UMTS; GSM) Q2 2012 MSM8960T Pro (MSM8960AB) MSM8960DT 2 cores up to 1.7GHz Krait 300: 4+4 KB L0, 16+16 KB L1, 1 MB L2 Q3 2013 APQ8064 4 cores up to 1.5GHz Krait : 4+4 KB L0, 16+16 KB L1, 2 MB L2 Adreno 320 400 MHz (QXGA / 1080p)LPDDR2 Dual-channel 533 MHzExternal 2012
Snapdragon 2 series The Snapdragon 2 series is the entry-level SoC designed for low-end or ultra-budget smartphones. It replaces the MSM8225 S4 Play model as the lowest-end SoC in the entire Snapdragon lineup.
Snapdragon 200 series (2013–2019) Model number Product name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability MSM8225Q Snapdragon 200 45 nm (TSMC 45LP) 4 cores up to 1.4 GHz Cortex-A5 Adreno 203 400 MHz (12.8 GFLOPS in FP32)Hexagon QDSP5Up to 8 MP single camera LPDDR2 Single-channel 333 MHzGobi 3G (UMTS: HSPA; GSM: GPRS/EDGE) Bluetooth 4.1; 802.11b/g/n 2.4 GHz; GPS: IZat Gen8B; USB 2.0 —N/a 2013 2013 MSM8625Q Gobi 3G (CDMA: 1×Rev.A, 1×EV-DO Rev.A/B; UMTS; GSM) MSM8210 28 nm (TSMC 28LP) 2 cores up to 1.2 GHz Cortex-A7 Adreno 302 400 MHz (12.8 GFLOPS in FP32)Hexagon QDSP6Gobi 3G (UMTS; GSM) MSM8610 Gobi 3G (CDMA/UMTS; GSM) MSM8212 4 cores up to 1.2 GHz Cortex-A7 Gobi 3G (UMTS; GSM) MSM8612 Gobi 3G (CDMA/UMTS; GSM) MSM8905 Qualcomm 205 2 cores up to 1.1 GHz Cortex-A7 Adreno 304 400 MHz (19.2 GFLOPS in FP32)Hexagon 536Up to 3 MP single camera LPDDR2 /3 Single-channel 384 MHzX5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.1 + BLE, 802.11n (2.4 GHz) 4.0 March 20, 2017 2017 MSM8208 Snapdragon 208 Up to 5 MP single camera LPDDR2 /3 Single-channel 400 MHzGobi 3G (multimode CDMA/UMTS: download up to 42 Mbit/s; GSM) 2.0 September 9, 2014 2014 MSM8909 Snapdragon 210 4 cores up to 1.1 GHz Cortex-A7 Up to 8 MP single camera LPDDR2 /3 Single-channel 533 MHzX5 LTE MSM8909AA Snapdragon 212 4 cores up to 1.3 GHz Cortex-A7 July 28, 2015 2015 QM215 Qualcomm 215 4 cores up to 1.3 GHz Cortex-A53 Adreno 308 485 MHz (23.3 GFLOPS in FP32)Hexagon Up to 13 MP single camera / 8 MP dual camera LPDDR3 Single-channel 672 MHz 3 GBX5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.2, NFC, 802.11ac Wi-Fi, Beidou, GPS, GLONASS, USB 2.0 1.0 July 9, 2019 Q3 2019
Snapdragon 4 series The Snapdragon 4 series is the entry-level SoC designed for the more upmarket entry-level segment, as opposed to the 2 series, which were aimed at ultra-budget segment. Similar to the 2 series, it is the successor of the S4 Play.
Snapdragon 400 series (2013–2021) Model number Product name Fab CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement date Sampling availability APQ8026 Snapdragon 400 28 nm (TSMC 28LP) 4 cores up to 1.2 GHz Cortex-A7 : 32 KB L1, 512 KB L2 Adreno 305 400 MHz (19.2 GFLOPS in FP32)Hexagon QDSP6Up to 13.5 MP single camera LPDDR2 /3 Single-channel 533 MHz—N/a Bluetooth 4.0, 802.11 b/g/n, Integrated IZat GNSS 1.0 2013 2013 MSM8226 Gobi 3G (UMTS: HSPA+ up to 21 Mbit/s; GSM: GPRS/EDGE) MSM8626 Gobi 3G (CDMA/UMTS) MSM8926 Gobi 4G (LTE Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) APQ8028 4 cores up to 1.6 GHz Cortex-A7 : 32 KB L1, 512 KB L2 Adreno 305 450 MHz (21.6 GFLOPS in FP32)—N/a MSM8228 Gobi 3G (UMTS) MSM8628 Gobi 3G (CDMA/UMTS) MSM8928 Gobi 4G (LTE Cat 4) MSM8230 2 cores up to 1.2 GHz Krait 200: 32 KB L1, 1 MB L2 Adreno 305 400 MHz (19.2 GFLOPS in FP32)LPDDR2 Single-channel 533 MHzGobi 3G (UMTS) MSM8630 Gobi 3G (CDMA/UMTS) MSM8930 Gobi 4G (LTE Cat 4) MSM8930AA 2 cores up to 1.4 GHz Krait 300: 32 KB L1, 1 MB L2 Gobi 4G (LTE Cat 4) APQ8030AB 2 cores up to 1.7 GHz Krait 300: 32 KB L1, 1 MB L2 Adreno 305 450 MHz (21.6 GFLOPS in FP32)—N/a MSM8230AB Gobi 3G (UMTS) MSM8630AB Gobi 3G (CDMA/UMTS) MSM8930AB Gobi 4G (LTE Cat 4) APQ8016 Snapdragon 410 28 nm (TSMC 28LP) / 28 nm (SMIC ) 4 cores up to 1.2 GHz Cortex-A53 Adreno 306 400/450 MHz (19.2/21.6 GFLOPS in FP32)Hexagon QDSP6 V5LPDDR2 /3 Single-channel 32-bit 533 MHz (4.2 GB/s)—N/a Bluetooth 4.0, 802.11n, NFC, GPS, GLONASS, BeiDou 2.0 December 9, 2013 H1 2014 MSM8916 X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) MSM8916 v2 Snapdragon 412 28 nm (TSMC 28LP) 4 cores up to 1.4 GHz Cortex-A53 Adreno 306 450 MHz (21.6 GFLOPS in FP32)LPDDR2 /3 Single-channel 32-bit 600 MHz (4.8 GB/s)July 28, 2015 H2 2015 MSM8929 Snapdragon 415 4 + 4 cores (1.4 GHz + 1.0 GHz Cortex-A53 ) Adreno 405 465 MHz (44.6 GFLOPS in FP32)Hexagon V50Up to 13 MP single camera LPDDR3 Single-channel 32-bit 667 MHz (5.3 GB/s)Bluetooth 4.1 + BLE Bluetooth, 802.11ac (2.4/5.0 GHz) Multi-User MIMO (MU-MIMO) Wi-Fi, IZat Gen8C Lite GPS February 18, 2015 H1 2015 MSM8917 Snapdragon 425 4 cores up to 1.4 GHz Cortex-A53 Adreno 308 598 MHz (28.7 GFLOPS in FP32)Hexagon 536Up to 16 MP single camera X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth v4.1, 802.11ac with Multi-User MIMO (MU-MIMO), IZat Gen8C February 11, 2016 Q3 2016 MSM8920 Snapdragon 427 X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 October 18, 2016 Q1 2017 MSM8937 Snapdragon 430 4 + 4 cores (1.4 GHz + 1.1 GHz Cortex-A53 ) Adreno 505 450 MHz (43.2 GFLOPS in FP32)Up to 21 MP single camera LPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s)X6 LTE September 15, 2015 Q2 2016 MSM8940 Snapdragon 435 X9 LTE February 11, 2016 Q4 2016 SDM429 Snapdragon 429 12 nm (TSMC 12FFC) 4 cores up to 2.0 GHz Cortex-A53 Adreno 504 320 MHz (30.7 GFLOPS in FP32)Hexagon 536Up to 16 MP single camera / 8 MP dual camera X6 LTE (download: Cat 4, up to 150 Mbit/s; upload: Cat 5, up to 75 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi up to 433 Mbit/s, USB 2.0 June 26, 2018 Q3 2018 SDM439 Snapdragon 439 4 + 4 cores (2.0 GHz + 1.45 GHz Cortex-A53 ) Adreno 505 650 MHz (62.4 GFLOPS in FP32)Up to 21 MP single camera / 8 MP dual camera SDM450 Snapdragon 450 14 nm (Samsung 14LPP) 8 cores up to 1.8 GHz Cortex-A53 Adreno 506 600 MHz (57.6 GFLOPS in FP32)Hexagon 546Up to 24 MP single camera / 13 MP dual camera LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, 802.11ac Wi-Fi up to 433 Mbit/s, USB 3.0 June 28, 2017 Q3 2017 SM4250-AA Snapdragon 460 11 nm (Samsung 11LPP) 4 + 4 cores (1.8 GHz Kryo 240 Gold – Cortex-A73 + 1.6 GHz Kryo 240 Silver – Cortex-A53 ) Adreno 610 600 MHz (153.6 GFLOPS in FP32)Hexagon 683Spectra 340 (48 MP single camera / 16 MP dual camera) LPDDR3 up to 933 MHz or LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, NFC , Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, NavIC , USB C January 20, 2020 Q1 2020 SM4350 Snapdragon 480 8 nm (Samsung 8LPP) 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.8 GHz Kryo 460 Silver – Cortex-A55 ) Adreno 619 650 MHz (332.8 GFLOPS in FP32)Hexagon 686 (3.3 TOPS)Spectra 345 (64 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17.0 GB/s)Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 660 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1, NFC , 802.11a/b/g/n/ac/ax-ready 2x2 (MU-MIMO), USB C 4+ January 4, 2021 H1 2021 SM4350-AC Snapdragon 480+ 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.9 GHz Kryo 460 Silver – Cortex-A55 ) FastConnect 6200, Bluetooth 5.2, NFC , 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB C October 26, 2021 Q4 2021
Snapdragon 4 (since 2022) Model number Product name Fab CPU (Cores / Freq)GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability SM4375 Snapdragon 4 Gen 1 6 nm (TSMC N6) Kryo 2 + 6 cores (2.0 GHz Cortex-A78 + 1.8 GHz Cortex-A55 )Adreno 619 700 MHz (358.4 GFLOPS in FP32)Hexagon Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), USB 3.1 4+ September 6, 2022 Q3 2022 SM4450 Snapdragon 4 Gen 2 4 nm (Samsung 4LPX) Kryo 2 + 6 cores (2.2 GHz Cortex-A78 + 1.95 GHz Cortex-A55 )Adreno 613 955 MHz (244.5 GFLOPS in FP32)—N/a Spectra (108 MP single camera / 16 MP dual camera with ZSL) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s) Bluetooth 5.1, 802.11a/b/g/n/ac 1x1, USB 3.2 Gen 1 June 26, 2023 Q2 2023 Snapdragon 4 Gen 2 Accelerated Edition Kryo 2 + 6 cores (2.3 GHz Cortex-A78 + 1.95 GHz Cortex-A55 )Adreno 613 1010 MHz (258.6 GFLOPS in FP32)May 17, 2024 Q2 2024 SM4635 Snapdragon 4s Gen 2 Kryo 2 + 6 cores (2.0 GHz Cortex-A78 + 1.8 GHz Cortex-A55 )Adreno 611Spectra (84 MP single camera / 16 MP dual camera with ZSL) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)Internal (5G NR Sub-6: download up to 1 Gbit/s) July 30, 2024 Q3 2024 SM4450-AF Snapdragon 4 Gen 4 Kryo 2 + 6 cores (2.3 GHz Cortex-A78 + 2.0 GHz Cortex-A55 )Adreno Spectra (108 MP single camera / 16 MP dual camera with ZSL) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal X61 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s) December 12, 2025 Q4 2025
Snapdragon 6 series The Snapdragon 6 series is the mid-range SoC primarily targeted at both the entry-level and mid-range segments, succeeding the S4 Plus. It is the most commonly used Snapdragon line-up, appearing in mainstream devices of various manufacturers.
Snapdragon 600 series (2013–2023) Unlike the later models of the 600 series, Snapdragon 600 was considered a high-end SoC similar to the Snapdragon 800, and was the direct successor of both the Snapdragon S4 Plus and S4 Pro. The Snapdragon 615 was Qualcomm's first octa-core SoC. Starting with the Snapdragon 610, the 600 series became a mid-range SoC lineup, as opposed to the original Snapdragon 600, which was a high-end model.
Model number Product name Fab CPU (Cores/Freq)GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability APQ8064-1AA (DEB/FLO) Snapdragon 600 (Advertised as S4 Pro) 28 nm (TSMC 28LP) 4 cores up to 1.5 GHz Krait 300 Adreno 320 400 MHz (76.8 GFLOPS in FP32)Hexagon QDSP6 V4 500 MHzUp to 21 MP single camera; Video Capture: 1080p@30fps DDR3L-1600 (12.8 GB/s) External Bluetooth 4.0, Wi-Fi 802.11ac (2.4/5 GHz), IZat Gen8A 1.0 January 8, 2013 Q1 2013 APQ8064M Snapdragon 600 4 cores up to 1.7 GHz Krait 300 LPDDR3 Dual-channel 32-bit (64-bit) 533 MHz (8.6 GB/s)APQ8064T Snapdragon 600 LPDDR3 Dual-channel 32-bit (64-bit) 600 MHz (9.6 GB/s)APQ8064AB Snapdragon 600 4 cores up to 1.9 GHz Krait 300 Adreno 320 450 MHz (86.4 GFLOPS in FP32)MSM8936 Snapdragon 610 4 cores up to 1.7 GHz Cortex-A53 Adreno 405 550 MHz (52.8 GFLOPS in FP32)Hexagon V50 700 MHzLPDDR3 Single-channel 32-bit 800 MHz (6.4 GB/s)X5 LTE (Cat 4: download up to 150 Mbit/s, upload up to 50 Mbit/s) Bluetooth 4.0, Qualcomm VIVE, Wi-Fi 802.11ac, NFC, GPS, Glonass, BeiDou 2.0 February 24, 2014 Q3 2014 MSM8939 Snapdragon 615 4 + 4 cores (1.7 GHz + 1.1 GHz) Cortex-A53 MSM8939 v2 Snapdragon 616 4 + 4 cores (1.7 GHz + 1.2 GHz) Cortex-A53 July 31, 2015 Q3 2015 MSM8952 Snapdragon 617 4 + 4 cores (1.5 GHz + 1.2 GHz) Cortex-A53 Hexagon 546LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C; USB 2.0 3.0 September 15, 2015 Q4 2015 MSM8953 Snapdragon 625 14 nm (Samsung 14LPP) 8 cores up to 2.0 GHz Cortex-A53 Adreno 506 650 MHz (62.4 GFLOPS in FP32)Up to 24 MP single camera; Video Capture: 4K@30fps X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 4.1, NFC, VIVE 1-stream Wi-Fi 802.11ac MU-MIMO, IZat Gen8C; USB 3.0 February 11, 2016 Q2 2016 MSM8953 Pro Snapdragon 626 8 cores up to 2.2 GHz Cortex-A53 October 18, 2016 Q4 2016 SDM630 Snapdragon 630 4 + 4 cores (2.2 GHz + 1.8 GHz) Cortex-A53 ) Adreno 508 650 MHz (124.8 GFLOPS in FP32)Hexagon 642Spectra 160 (24 MP single camera / 13 MP dual camera; Video Capture: 4K@30fps) LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.66 GB/s)X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi 1x1, NFC , USB 3.1 4.0 May 8, 2017 Q2 2017 SDM632 Snapdragon 632 4 + 4 cores (1.8 GHz Kryo 250 Gold – Cortex-A73 + 1.8 GHz Kryo 250 Silver – Cortex-A53 ) Adreno 506 725 MHz (69.6 GFLOPS in FP32)Hexagon 546Up to 40 MP single camera, 13 MP dual camera; Video Capture: 4K@30fps LPDDR3 Single-channel 32-bit 933 MHz (7.5 GB/s)X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 3.0 June 26, 2018 Q3 2018 SDM636 Snapdragon 636 4 + 4 cores (1.8 GHz Kryo 260 Gold – Cortex-A73 + 1.6 GHz Kryo 260 Silver – Cortex-A53 ) Adreno 509 430 MHz (110.1 GFLOPS in FP32)Hexagon 680Spectra 160 (24 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) LPDDR4 Dual-channel 16-bit (32-bit) 1333 MHz (10.7 GB/s)X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) 4.0 October 17, 2017 Q4 2017 MSM8956 Snapdragon 650 28 nm (TSMC 28HPM) 2 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53 ) Adreno 510 600 MHz (153.6 GFLOPS in FP32)Hexagon V56Up to 21 MP single camera; Video Capture: 4K@30fps LPDDR3 Dual-channel 32-bit (64-bit) 933 MHz (14.9 GB/s)X8 LTE (Cat 7: download up to 300 Mbit/s, upload up to 100 Mbit/s) Bluetooth Smart 4.1, VIVE 1-stream 802.11ac Wi-Fi, IZat Gen8C GNSS; USB 2.0 3.0 February 18, 2015 Q1 2016 MSM8976 Snapdragon 652 4 + 4 cores (1.8 GHz Cortex-A72 + 1.4 GHz Cortex-A53 ) MSM8976 Pro Snapdragon 653 4 + 4 cores (1.95 GHz Cortex-A72 + 1.4 GHz Cortex-A53 ) Adreno 510 621 MHz (159 GFLOPS in FP32)X9 LTE (download: Cat 7, up to 300 Mbit/s; upload: Cat 13, up to 150 Mbit/s) October 18, 2016 Q4 2016 SDM660 Snapdragon 660 14 nm (Samsung 14LPP) 4 + 4 cores (2.2 GHz Kryo 260 Gold – Cortex-A73 + 1.84 GHz Kryo 260 Silver – Cortex-A53 ) Adreno 512 647 MHz (165.6 GFLOPS in FP32)Hexagon 680Spectra 160 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5, 802.11ac Wi-Fi, NFC , USB 3.1 4.0 May 8, 2017 Q2 2017 SDA660 Snapdragon 660 Internal: no SM6115 Snapdragon 662 11 nm (Samsung 11LPP) 4 + 4 cores (2.0 GHz Kryo 260 Gold – Cortex-A73 + 1.8 GHz Kryo 260 Silver – Cortex-A53 ) Adreno 610 950 MHz (243.2 GFLOPS in FP32)Hexagon 683Spectra 340T (48 MP single camera / 13 MP dual camera; Video Capture: 1080p@60fps) LPDDR3 933 MHz LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, NFC , Wi-Fi 802.11ac Wave 2, 802.11ax-ready, NavIC , USB C 3.0 January 20, 2020 Q1 2020 SM6125 Snapdragon 665 Hexagon 686 (3.3 TOPS)Spectra 165 (48 MP single camera / 16 MP dual camera; Video Capture: 4K@30fps) X12 LTE (download: Cat 12, up to 600 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.1, Wi-Fi 802.11ac, NFC , USB 3.1 April 9, 2019 Q2 2019 SDM670 Snapdragon 670 10 nm (Samsung 10LPP) 2 + 6 cores (2.0 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55 ) Adreno 615 430 MHz (220.2 GFLOPS in FP32)Hexagon 685 (3 TOPS)Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)Bluetooth 5, 802.11ac Wi-Fi, NFC , USB 3.1 4+ August 8, 2018 Q3 2018 SM6150 Snapdragon 675 11 nm (Samsung 11LPP) 2 + 6 cores (2.0 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55 ) Adreno 612 845 MHz (216.3 GFLOPS in FP32)Spectra 250L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) October 22, 2018 Q1 2019 SM6150- AC Snapdragon 678 2 + 6 cores (2.2 GHz Kryo 460 Gold – Cortex-A76 + 1.7 GHz Kryo 460 Silver – Cortex-A55 ) Adreno 612 895 MHz (229.1 GFLOPS in FP32)December 15, 2020 Q4 2020 SM6225 Snapdragon 680 6 nm (TSMC N6) 4 + 4 cores (2.4 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53 ) Adreno 610 1114 MHz (285.2 GFLOPS in FP32)Hexagon 686 (3.3 TOPS)Spectra 346 (64 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11ac Wave 2, NFC , NavIC , USB C 3.0 October 26, 2021 Q4 2021 SM6225- AD Snapdragon 685 4 + 4 cores (2.8 GHz Kryo 265 Gold – Cortex-A73 + 1.9 GHz Kryo 265 Silver – Cortex-A53 ) Adreno 610 1260 MHz (322.6 GFLOPS in FP32)Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) FastConnect 6200, Bluetooth 5.2, Wi-Fi 802.1ac 1x1, USB 3.1 March 23, 2023 Q1 2023 SM6350 Snapdragon 690 8 nm (Samsung 8LPP) 2 + 6 cores (2.0 GHz Kryo 560 Gold – Cortex-A77 + 1.7 GHz Kryo 560 Silver – Cortex-A55 ) Adreno 619L 565 MHz (289.3 GFLOPS in FP32)Hexagon 692 (5 TOPS)Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)Internal X51 5G (5G NR Sub-6: download up to 2.5 Gbit/s, upload up to 900 Mbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.1, 802.11ac/ax 2x2 (MU-MIMO), NFC , USB 3.1 4+ June 16, 2020 H2 2020 SM6375 Snapdragon 695 6 nm (TSMC N6) 2 + 6 cores (2.2 GHz Kryo 660 Gold – Cortex-A78 + 1.8 GHz Kryo 660 Silver – Cortex-A55 ) Adreno 619 840 MHz (430.1 GFLOPS in FP32)Hexagon 686 (3.3 TOPS)Spectra 346T (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, 802.11ac 2x2 (MU-MIMO), NFC , USB C October 26, 2021 Q4 2021
Snapdragon 6s 4G (since 2024) The 600 series concluded in 2023 with the 695. The 6s 4G series (2024–) targets cost-sensitive 4G-only markets using recycled architectures on mature nodes. Notable examples include the 6s 4G Gen 1 (rebadged SM6115 (Snapdragon 662) from 2020) and Gen 2 (rebadged SM6225 (Snapdragon 680/685) from 2021).
Model number Product name Fab CPU (Cores / Freq)GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability SM6115-AC Snapdragon 6s 4G Gen 1 11 nm (Samsung 11LPP) Kryo 4 + 4 cores (2.1 GHz Cortex-A73 + 2.0 GHz Cortex-A53 )Adreno 610 1050 MHz (268.8 GFLOPS in FP32)Hexagon Spectra (48 MP single camera / 13 MP dual camera with ZSL; Video Capture: 1080p@60fps) LPDDR3 up to 933 MHz / LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)X11 LTE (Cat 13: download up to 390 Mbit/s, upload up to 150 Mbit/s) FastConnect 6100, Bluetooth 5.1, Wi-Fi 802.11a/b/g/n, 802.11ac Wave 2, 802.11ax-ready, USB C 3.0 August 9, 2024 Q3 2024 SM6225-AF Snapdragon 6s 4G Gen 2 6 nm (TSMC N6) Kryo 4 + 4 cores (2.9 GHz Cortex-A73 + 1.9 GHz Cortex-A53 )Adreno 610Hexagon Spectra (108 MP single camera / 16 MP dual camera with ZSL / 13+13+5 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)FastConnect 6200, Bluetooth 5.2, Wi-Fi 802.1ac 1x1, USB 3.1 December 12, 2025 Q4 2025
Snapdragon 6 (since 2022) Qualcomm adopted generational naming in 2022 with the Snapdragon 6 series. All models feature integrated 5G modems and Wi-Fi 6/6E. The "6s" variants offer reduced specifications at lower price points. The series transitioned from Samsung 4LPX (Gen 1) to TSMC N4P (Gen 4), achieving significant efficiency gains. The Gen 4 introduces Cortex-A720/A520 cores, marking the first departure from A78/A55 combinations in the lineup and bringing architecture parity with the 7- and 8-series designs albeit with smaller cores at lower clock speeds.
Model number Product name Fab CPU (Cores / Freq)GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability SM6450 Snapdragon 6 Gen 1 4 nm (Samsung 4LPX) Kryo 4 + 4 cores (2.2 GHz Cortex-A78 + 1.8 GHz Cortex-A55 )Adreno 710 676 MHz (346.1 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 25+16 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5 Dual-channel 16-bit (32-bit) 2750 MHz (22 GB/s) Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 4+ September 6, 2022 Q1 2023 SM6475-AB Snapdragon 6 Gen 3 Kryo 4 + 4 cores (2.4 GHz Cortex-A78 + 1.8 GHz Cortex-A55 )Adreno 710 940 MHz (481.3 GFLOPS in FP32) or 1010 MHz (517.1 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) August 31, 2024 Q3 2024 SM6375-AC Snapdragon 6s Gen 3 6 nm (TSMC N6) Kryo 2 + 6 cores (2.3 GHz Cortex-A78 + 2.0 GHz Cortex-A55 )Adreno 619 900 MHz (460.8 GFLOPS in FP32)Hexagon Spectra (108 MP single camera / 25+13 MP dual camera with ZSL / 13 MP triple camera with ZSL; Video Capture: 1080p@60fps) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)Internal X51 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 1.5 Gbit/s; LTE: download Cat 15, up to 800 Mbit/s, upload Cat 18, up to 210 Mbit/s) FastConnect 6200, Bluetooth 5.2, 802.11a/b/g/n/ac 2x2 (MU-MIMO), NavIC, USB C June 6, 2024 Q2 2024 SM6650 Snapdragon 6 Gen 4 4 nm (TSMC N4P) Kryo (1× 2.3 GHz Cortex-A720 + 3× 2.2 GHz Cortex-A720 + 4× 1.8 GHz Cortex-A520 )Adreno 810 895 MHz (458.2 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 February 12, 2025 Q1 2025 SM6435-AA Snapdragon 6s Gen 4 4 nm (Samsung 4LPX) Kryo 4 + 4 cores (2.4 GHz Cortex-A78 + 1.8 GHz Cortex-A55 )Adreno 710Hexagon Spectra (200 MP Photo Capture / 32 MP single camera with ZSL / 16+16 MP dual camera with ZSL; Video Capture: 2K@30fps HDR) October 24, 2025 Q4 2025
Snapdragon 7 series On February 27, 2018, Qualcomm Introduced the Snapdragon 7 Mobile Platform Series. It is an upper mid-range SoC designed to bridge the gap between the 6 series and the 8 series (the predecessor of Snapdragon 7 series is Snapdragon 660), and primarily aimed at premium mid-range segment.
Snapdragon 700 series (2018–2022) Modelnumber Productname Fab CPU (ARMv8.2 )GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability SDM710 Snapdragon 710 10 nm (Samsung 10LPP) 2 + 6 cores (2.2 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55 ) Adreno 616 504 MHz (258 GFLOPS in FP32)Hexagon 685 (3 TOPS)Spectra 250 (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) LPDDR4X Dual-channel 16-bit (32-bit) 1866 MHz (14.9 GB/s)X15 LTE (download: Cat 15, up to 800 Mbit/s; upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0; NFC ; 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 4 May 23, 2018 Q2 2018 SDM712 Snapdragon 712 2 + 6 cores (2.3 GHz Kryo 360 Gold – Cortex-A75 + 1.7 GHz Kryo 360 Silver – Cortex-A55 ) Adreno 616 610 MHz (312.3 GFLOPS in FP32)4+ February 6, 2019 Q1 2019 SM7125 Snapdragon 720G 8 nm (Samsung 8LPP) 2 + 6 cores (2.3 GHz Kryo 465 Gold – Cortex-A76 + 1.8 GHz Kryo 465 Silver – Cortex-A55 ) Adreno 618 750 MHz (384 GFLOPS in FP32)Hexagon 692 (5 TOPS)Spectra 350L (192 MP single camera / 16 MP dual camera with ZSL; Video Capture: 4K@30fps) FastConnect 6200; Bluetooth 5.1; NFC ; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, NavIC ; USB 3.1 January 20, 2020 Q1 2020 SM7150-AA Snapdragon 730 2 + 6 cores (2.2 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55 ) Adreno 618 610 MHz (312.3 GFLOPS in FP32)Hexagon 688 (3.6 TOPs)Spectra 350 (192 MP single camera / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) FastConnect 6200; Bluetooth 5.0; NFC ; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 April 9, 2019 Q2 2019 SM7150-AB Snapdragon 730G Adreno 618 700 MHz (358.4 GFLOPS in FP32)SM7150-AC Snapdragon 732G 2 + 6 cores (2.3 GHz Kryo 470 Gold – Cortex-A76 + 1.8 GHz Kryo 470 Silver – Cortex-A55 ) Adreno 618 800 MHz (409.6 GFLOPS in FP32)FastConnect 6200; Bluetooth 5.1; NFC ; 802.11ac/ax 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s; GPS, GLONASS, Beidou, Galileo, QZSS, SBAS; USB 3.1 August 31, 2020 Q3 2020 SM7225 Snapdragon 750G 2 + 6 cores (2.2 GHz Kryo 570 Gold – Cortex-A77 + 1.8 GHz Kryo 570 Silver – Cortex-A55 ) Adreno 619 800 MHz (409.6 GFLOPS in FP32)Hexagon 694 (4.7 TOPs)Spectra 355L (192 MP single camera / 32+16 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X Dual-channel 16-bit (32-bit), 2133 MHz (17 GB/s)Internal X52 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6200; Bluetooth 5.1; NFC ; 802.11ac/ax-ready 2x2 (MU-MIMO); GPS , GLONASS , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1 September 22, 2020 Q4 2020 SM7250-AA Snapdragon 765 7 nm (Samsung 7LPP) 1x 2.3 GHz Kryo 475 Prime (Cortex-A76 ) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76 ) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55 ) Adreno 620 540 MHz (414.7 GFLOPS in FP32)Hexagon 696 (5.4 TOPs)Spectra 355 (192 MP Photo Capture / 36 MP single camera with ZSL / 22 MP dual camera with ZSL; Video Capture: 4K@30fps HDR) FastConnect 6200; Bluetooth 5.0; NFC ; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1 December 4, 2019 Q1 2020 SM7250-AB Snapdragon 765G 1x 2.4 GHz Kryo 475 Prime (Cortex-A76 ) + 1x 2.2 GHz Kryo 475 Gold (Cortex-A76 ) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55 ) Adreno 620 625 MHz (480 GFLOPS in FP32)SM7250-AC Snapdragon 768G 1x 2.8 GHz Kryo 475 Prime (Cortex-A76 ) + 1x 2.4 GHz Kryo 475 Gold (Cortex-A76 ) + 6x 1.8 GHz Kryo 475 Silver (Cortex-A55 ) Adreno 620 750 MHz (576 GFLOPS in FP32)FastConnect 6200; Bluetooth 5.2; NFC ; 802.11ac/ax 2x2 (MU-MIMO) up to 867 Mbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1 May 10, 2020 Q2 2020 SM7325 Snapdragon 778G 6 nm (TSMC N6) 1x 2.4 GHz Kryo 670 Prime (Cortex-A78 ) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78 ) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55 ) Adreno 642L 550 MHz (563.2 GFLOPS in FP32)Hexagon 770 (12 TOPs)Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 May 19, 2021 Q2 2021 SM7325-AE Snapdragon 778G+ 1x 2.5 GHz Kryo 670 Prime (Cortex-A78 ) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78 ) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55 ) Adreno 642L 608 MHz (622.6 GFLOPS in FP32)October 26, 2021 Q4 2021 SM7350-AB Snapdragon 780G 5 nm (Samsung 5LPE) 1x 2.4 GHz Kryo 670 Prime (Cortex-A78 ) + 3x 2.2 GHz Kryo 670 Gold (Cortex-A78 ) + 4x 1.9 GHz Kryo 670 Silver (Cortex-A55 ) Adreno 642 490 MHz (752.6 GFLOPS in FP32)Spectra 570 (192 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17 GB/s)Internal: X53 5G (5G NR Sub-6: download up to 3.3 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6900; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 March 25, 2021 Q1 2021 SM7325-AF Snapdragon 782G 6 nm (TSMC N6) 1x 2.7 GHz Kryo 670 Prime (Cortex-A78 ) + 3x 2.4 GHz Kryo 670 Gold (Cortex-A78 ) + 4x 1.8 GHz Kryo 670 Silver (Cortex-A55 ) Adreno 642L 719 MHz (736.3 GFLOPS in FP32)Spectra 570L (200 MP Photo Capture / 64 MP single camera with ZSL / 36+22 MP dual camera with ZSL / 22 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal: X53 5G (5G NR Sub-6 & mmWave: download up to 3.7 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11ac/ax (Wi-Fi 6) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 November 23, 2022 Q4 2022
Snapdragon 7 (since 2022) Model number Product name Fab Die size CPU (Cores / Freq)GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability SM7450-AB Snapdragon 7 Gen 1 4 nm (Samsung 4LPX) 77.8mm2 Kryo (1× 2.4 GHz {2.5 GHz Accelerated Edition} Cortex-A710 + 3× 2.36 GHz Cortex-A710 + 4× 1.8 GHz Cortex-A510 )Adreno 644 443 MHz (680.4 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 84 MP single camera with ZSL / 64+20 MP dual camera with ZSL / 25 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 4+ May 20, 2022 Q2 2022 SM7475-AB Snapdragon 7+ Gen 2 4 nm (TSMC N4) 102.6 mm2 Kryo (1× 2.91 GHz Cortex-X2 + 3× 2.49 GHz Cortex-A710 + 4× 1.8 GHz Cortex-A510 )Adreno 725 580 MHz (1187.8 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 32 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GB/s)FastConnect 6900; Bluetooth 5.3; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 3.6 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 5 March 17, 2023 Q1 2023 SM7435-AB Snapdragon 7s Gen 2 4 nm (Samsung 4LPX) Kryo 4 + 4 cores (2.4 GHz Cortex-A78 + 1.95 GHz Cortex-A55 )Adreno 710 940 MHz (481.3 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 48 MP single camera with ZSL / 32+16 MP dual camera with ZSL / 16 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 4+ September 15, 2023 Q3 2023 SM7550-AB Snapdragon 7 Gen 3 4 nm (TSMC N4P) Kryo (1× 2.63 GHz Cortex-A715 + 3× 2.4 GHz Cortex-A715 + 4× 1.8 GHz Cortex-A510 )Adreno 720 975 MHz (998.4 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) Internal: X63 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s, upload up to 3.5 Gbit/s) FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 5 November 17, 2023 Q4 2023 SM7675-AB Snapdragon 7+ Gen 3 89.54 mm2 Kryo (1× 2.8 GHz Cortex-X4 + 4× 2.6 GHz Cortex-A720 + 3× 1.9 GHz Cortex-A520 )Adreno 732 950 MHz (1459.2 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 108 MP single camera with ZSL / 64+36 MP dual camera with ZSL / 36 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)FastConnect 7800; Bluetooth 5.4; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 March 21, 2024 Q1 2024 SM7635 Snapdragon 7s Gen 3 Kryo (1× 2.5 GHz Cortex-A720 + 3× 2.4 GHz Cortex-A720 + 4× 1.8 GHz Cortex-A520 )Adreno 810 1050 MHz (537.6 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 4+ August 20, 2024 Q3 2024 SM7750-AB Snapdragon 7 Gen 4 Kryo (1× 2.8 GHz Cortex-A720 + 4× 2.4 GHz Cortex-A720 + 3× 1.84 GHz Cortex-A520 )Adreno 722 1150 MHz (1177.6 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@60fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s) or LPDDR5X dual-channel 16-bit (32-bit) 4200 MHz (33.6 GB/s)Internal (5G NR Sub-6: download up to 4.2 Gbit/s) FastConnect 7700; Bluetooth 6.0; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) up to 5.8 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 5 May 15, 2025 Q2 2025 SM7635-AC Snapdragon 7s Gen 4 Kryo (1× 2.7 GHz Cortex-A720 + 3× 2.4 GHz Cortex-A720 + 4× 1.8 GHz Cortex-A520 )Adreno 810 1150 MHz (588.8 GFLOPS in FP32)Hexagon Spectra (200 MP Photo Capture / 64 MP single camera with ZSL / 32+21 MP dual camera with ZSL / 21 MP triple camera with ZSL; Video Capture: 4K@30fps HDR) LPDDR4X dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s) or LPDDR5 dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal: X62 5G (5G NR Sub-6 & mmWave: download up to 2.9 Gbit/s, upload up to 1.6 Gbit/s; LTE Cat 18: download up to 1.2 Gbit/s, upload up to 210 Mbit/s) FastConnect 6700; Bluetooth 5.4; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.1 4+ August 19, 2025 Q3 2025
Snapdragon 8 series The Snapdragon 8 series is the high-end SoC and serves as Qualcomm's current flagship, succeeding the S4 Pro and the older S1/S2/S3 series.
Snapdragon 800 series (2013–2021) Model number Product name Fab Die size CPU GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability APQ8074AA Snapdragon 800 28 nm (TSMC 28HPM) 118 mm2 4 cores 2.26 GHz Krait 400; 4 KiB + 4 KiB L0 cache, 16 KiB + 16 KiB L1 cache and 2 MiB L2 cache Adreno 330 450 MHz (115.2 GFLOPS in FP32)Hexagon QDSP6 V5 600 MHz21 MP single camera (Video capture: 4K@30fps) LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)—N/a Bluetooth 4.0 802.11ac (2.4/5 GHz); IZat Gen8B2.0 January 8, 2013 Q2 2013 MSM8274AA Gobi 3G (UMTS) MSM8674AA Gobi 3G (CDMA, UMTS) MSM8974AA Gobi 4G (LTE Cat 4: download 150 Mbit/s, upload 50 Mbit/s MSM8974AA v3 Snapdragon 801 Gobi 4G (LTE Cat 4) February 24, 2014 Q3 2014 APQ8074AB v3 4 cores 2.36 GHz Krait 400 Adreno 330 578 MHz (150 GFLOPS in FP32)LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)—N/a Q4 2013 MSM8274AB Snapdragon 800 118 mm2 Gobi 3G (UMTS) January 8, 2013 Q4 2013 MSM8674AB v3 Snapdragon 801 Gobi 3G (CDMA, UMTS) February 24, 2014 Q2 2013 MSM8974AB v3 Gobi 4G (LTE Cat 4) Q4 2013 MSM8274AC v3 4 cores 2.45 GHz Krait 400 Gobi 3G (UMTS) Q2 2014 MSM8974AC v3 Gobi 4G (LTE Cat 4) Q1 2014 APQ8084 Snapdragon 805 4 cores 2.7 GHz Krait 450 Adreno 420 600 MHz (153.6 GFLOPS in FP32)Hexagon V50 800 MHz55 MP single camera (Video capture: 4K@30fps) LPDDR3 Dual-channel 64-bit 800 MHz (25.6 GB/s)External Bluetooth 4.1 802.11ac (2.4/5 GHz) IZat Gen8B November 20, 2013 Q1 2014 MSM8992 Snapdragon 808 20 nm (TSMC) 2 + 4 cores (1.82 GHz Cortex-A57 + 1.44 GHz Cortex-A53 ) Adreno 418 600 MHz (153.6 GFLOPS in FP32)Hexagon V56 800 MHzUp to 21 MP single camera (Video capture: 4K@30fps) LPDDR3 Dual-channel 32-bit 933 MHz (14.9 GB/s)X10 LTE (Cat 9: download 450 Mbit/s, upload 50 Mbit/s) Bluetooth 4.1 802.11ac IZat Gen8C April 7, 2014 Q3 2014 MSM8994 v1 Snapdragon 810 4 + 4 cores (2.0 GHz Cortex-A57 + 1.5 GHz Cortex-A53 ) Adreno 430 600 MHz (230.4 GFLOPS in FP32)55 MP single camera (Video capture: 4K@30fps) LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)MSM8994 v2 Adreno 430 630 MHz (241.9 GFLOPS in FP32)2015 MSM8994 v2.1 Q2 2015 MSM8996 Lite Snapdragon 820 14 nm FinFET (Samsung 14LPP) 113.7 mm2 2 + 2 cores Kryo (1.8 GHz + 1.36 GHz) Adreno 530 510 MHz (261.1 GFLOPS in FP32)Hexagon 680 1.0 GHzSpectra (28 MP Photo Capture / 25 MP at 30fps single camera with ZSL / 13 MP Dual Camera with ZSL; Video capture: 4K@30fps) LPDDR4 Quad-channel 16-bit (64-bit) 1333 MHz (21.3 GB/s)X12 LTE (download: Cat 12, 600 Mbit/s; 3x20 MHz CA; 64-QAM; 4x4 MIMO on 1C. upload: Cat 13, 150 Mbit/s; 2x20 MHz CA; 64-QAM.) Bluetooth 4.1 802.11ac IZat Gen8C 3.0 March 2, 2015 Q1 2016 MSM8996 2 + 2 cores Kryo (2.15 GHz + 1.593 GHz) Adreno 530 624 MHz (319.5 GFLOPS in FP32)LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)Q4 2015 MSM8996 Pro-AB Snapdragon 821 July 11, 2016 Q3 2016 MSM8996 Pro-AC 2 + 2 cores Kryo (2.342 GHz + 1.6/2.188 GHz) Adreno 530 653 MHz (334.3 GFLOPS in FP32)MSM8998 Snapdragon 835 10 nm FinFET (Samsung 10LPE) 72.3 mm2 4 + 4 cores Kryo 280 (2.45 GHz Cortex-A73 + 1.9 GHz Cortex-A53 ) Adreno 540 670/710 MHz (343/363.5 GFLOPS in FP32)Hexagon 682Spectra 180 (32 MP Photo capture / 25 MP at 30fps single camera with ZSL / 16 MP Dual Camera with ZSL; Video capture: 4K@30fps) LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.8 GB/s)X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5.0; 802.11ac/ad; GPS, Glonass, Beidou, Galileo, QZSS, SBAS 4.0 November 17, 2016 Q2 2017 SDM845 Snapdragon 845 10 nm FinFET (Samsung 10LPP) 95.0 mm2 4 + 4 cores Kryo 385 (2.8 GHz Cortex-A75 + 1.8 GHz Cortex-A55 ) Adreno 630 710 MHz (727 GFLOPS in FP32)Hexagon 685 (3 TOPs)Spectra 280 (192 MP Photo capture / 48 MP single camera with MFNR / 32 MP at 30fps single camera with MFNR/ZSL / 16 MP at 60fps single camera with MFNR/ZSL / 16 MP at 30fps Dual Camera with MFNR/ZSL; Video capture: 4K@60fps) X20 LTE (download: Cat 18, @ 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, @ 150 Mbit/s; 2x20 MHz CA; 64-QAM) 4+ December 7, 2017 Q1 2018 SM8150 Snapdragon 855 7 nm (TSMC N7) 76.9 mm2 1 + 3 + 4 cores Kryo 485 (2.84 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.8 GHz Cortex-A55 ) Adreno 640 585 MHz (898.6 GFLOPS in FP32)Hexagon 690 (7 TOPs)Spectra 380 (192 MP single camera / 48 MP at 30 fps single camera with MFNR/ZSL / 22 MP at 30 fps dual camera with MFNR/ZSL; Video capture: 4K@60fps HDR) LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s)Internal: X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) + External: X50 5G (5G NR Sub-6 & mmWave: download up to 5 Gbit/s)Bluetooth 5.0; 802.11ax (Wi-Fi 6); GPS , Glonass , Beidou , Galileo , QZSS , SBAS ; USB 3.1 December 5, 2018 Q1 2019 SM8150-AC Snapdragon 855+ 1 + 3 + 4 cores Kryo 485 (2.96 GHz Cortex-A76 + 2.42 GHz Cortex-A76 + 1.80 GHz Cortex-A55 ) Adreno 640 675 MHz (1036.8 GFLOPS in FP32)July 15, 2019 Q3 2019 Snapdragon 860 March 22, 2021 Q1 2021 SM8150P Snapdragon 855+ Internal: no + External: X55 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)July 15, 2019 Q3 2019 SM8250 Snapdragon 865 7 nm (TSMC N7P) 86.8 mm2 1 + 3 + 4 cores Kryo 585 (2.84 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55 ) Adreno 650 587 MHz (901.6 GFLOPS in FP32)Hexagon 698 (15 TOPs)Spectra 480 (200 MP Photo Capture / 64 MP at 30 fps single camera with MFNR/ZSL / 25 MP at 30 fps dual camera with MFNR/ZSL; Video capture: 8K@30fps, 4K@120fps HDR) LPDDR5 Quad-channel 16-bit (64-bit) 2750 MHz (44 GB/s) or LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.13 GB/s) Internal: none + External: X55 5G (5G NR Sub-6 & mmWave: download @ 7.5 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)FastConnect 6800 : Bluetooth 5.1; 802.11ax (Wi-Fi 6) @ 1.774 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS , Glonass , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1December 4, 2019 Q1 2020 SM8250-AB Snapdragon 865+ 1 + 3 + 4 cores Kryo 585 (3.1 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55 ) Adreno 650 670 MHz (1029.1 GFLOPS in FP32)FastConnect 6900: Bluetooth 5.2; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS , Glonass , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1July 8, 2020 Q3 2020 SM8250-AC Snapdragon 870 1 + 3 + 4 cores Kryo 585 (3.2 GHz Cortex-A77 + 2.42 GHz Cortex-A77 + 1.80 GHz Cortex-A55 ) FastConnect 6800 Bluetooth 5.2 802.11ax (Wi-Fi 6) @ 1.774 Gbit/s; 802.11ad/ay 60 GHz @ 10 Gbit/s; GPS , Glonass , NavIC , Beidou , Galileo , QZSS , SBAS ; USB 3.1January 19, 2021 Q1 2021 SM8350 Snapdragon 888 5 nm (Samsung 5LPE) 112.2 mm2 1 + 3 + 4 cores Kryo 680 (2.84 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55 ) Adreno 660 840 MHz (1290.2 GFLOPS in FP32)Hexagon 780 (26 TOPs)Spectra 580 (200 MP Photo Capture; 84 MP single camera @ 30 fps MFNR/ZSL, 64 MP dual camera @ 30fps ZSL, 28 MP triple camera @ 30fps ZSL; Video Capture: 8K@30fps, 4K@120fps HDR) LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) Internal: X60 5G (5G NR Sub-6 & mmWave: download 7.5 Gbit/s, upload 3 Gbit/s; LTE Cat 22: download 2.5 Gbit/s, upload 0.316 Gbit/s)FastConnect 6900: Bluetooth 5.2 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS , Glonass , NavIC , Beidou , Galileo , QZSS ; USB 3.15 December 1, 2020 Q1 2021 SM8350-AC Snapdragon 888+ 1 + 3 + 4 cores Kryo 680 (3.0 GHz Cortex-X1 + 2.42 GHz Cortex-A78 + 1.80 GHz Cortex-A55 ) Hexagon 780 (32 TOPs)June 28, 2021 Q3 2021
Snapdragon 8 (since 2021) Model number Product name Fab Die size CPU (ARMv9 ) (Cores / Freq)GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Released SM8450 Snapdragon 8 Gen 1 4 nm (Samsung 4LPX) 128.5 mm2 Kryo (1× 3.0 GHz Cortex-X2 + 3× 2.5 GHz Cortex-A710 + 4× 1.8 GHz Cortex-A510 )Adreno 730 818 MHz (1675.3 GFLOPs in FP32)Hexagon Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 8K@30fps HDR) LPDDR5 Quad-channel 16-bit (64-bit) 3200 MHz (51.2 GiB/s) Internal: X65 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)FastConnect 6900 : Bluetooth 5.3; 802.11ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS , GLONASS , NavIC , Beidou , Galileo , QZSS ; USB 3.15 November 30, 2021 Q4 2021 SM8475 Snapdragon 8+ Gen 1 4 nm (TSMC N4) 102.6 mm2 Adreno 730 900 MHz (1843.2 GFLOPS in FP32)May 20, 2022 Q4 2022 Kryo (1× 3.2 GHz Cortex-X2 + 3× 2.75 GHz Cortex-A710 + 4× 2.0 GHz Cortex-A510 )Q2 2022 SM8425 Snapdragon 8+ Gen 1 4G Internal: (LTE Cat 22: download @ 2.5 Gbit/s, upload @ 0.316 Gbit/s)Q3 2022 SM8550-AB Snapdragon 8 Gen 2 4 nm (TSMC N4) 118.4 mm2 Kryo (1× 3.19 GHz Cortex-X3 + 4× 2.8 GHz {2×Cortex-A715 , 2×Cortex-A710 } + 3× 2.0 GHz Cortex-A510 )Adreno 740 680 MHz (2089 GFLOPS in FP32)LPDDR5X Quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)Internal : X70 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s)FastConnect 7800 : Bluetooth 5.3; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS , Glonass , NavIC , Beidou , Galileo , QZSS ; USB 3.1orFastConnect 6900 : Bluetooth 5.3; 802.11ac/ax (Wi-Fi 6E) @ 3.6 Gbit/s; GPS , Glonass , NavIC , Beidou , Galileo , QZSS ; USB 3.1November 15, 2022 Q4 2022 SM8550-AC Snapdragon 8 Gen 2 for Galaxy Kryo (1× 3.36 GHz Cortex-X3 + 4× 2.8 GHz {2×Cortex-A715 , 2×Cortex-A710 } + 3× 2.0 GHz Cortex-A510 )Adreno 740 719 MHz (2208.8 GFLOPS in FP32)Q1 2023 SM8650-AB Snapdragon 8 Gen 3 4 nm (TSMC N4P) 137.3 mm2 Kryo (1× 3.3 GHz Cortex-X4 + 3× 3.15 GHz Cortex-A720 + 2× 2.96 GHz Cortex-A720 + 2× 2.27 GHz Cortex-A520 )Adreno 750 903 MHz (2774 GFLOPS in FP32)LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)Internal : X75 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s)FastConnect 7800 : Bluetooth 5.4; 802.11ac/ax/be (Wi-Fi 7) @ 5.8 Gbit/s; GPS , Glonass , NavIC , Beidou , Galileo , QZSS ; USB 3.1October 24, 2023 Q4 2023 SM8650-AA Kryo (1× 3.05 GHz Cortex-X4 + 5× 2.96 GHz Cortex-A720 + 2× 2.04 GHz Cortex-A520 )Q4 2024 SM8650-Q-AB Kryo (1× 3.30 GHz Cortex-X4 + 4× 2.96 GHz Cortex-A720 + 1× 2.27 GHz Cortex-A520 )—N/a Q3 2025 SM8650-Q-AA Kryo (1× 3.05 GHz Cortex-X4 + 4× 2.96 GHz Cortex-A720 + 1× 2.04 GHz Cortex-A520 )SM8650-AC Snapdragon 8 Gen 3 for Galaxy Kryo (1× 3.4 GHz Cortex-X4 + 3× 3.15 GHz Cortex-A720 + 2× 2.96 GHz Cortex-A720 + 2× 2.27 GHz Cortex-A520 )Adreno 750 1000 MHz (3072 GFLOPS in FP32)Internal : X75 5G (5G NR Sub-6 & mmWave: download @ 10 Gbit/s, upload @ 3.5 Gbit/s)Q1 2024 SM8635 Snapdragon 8s Gen 3 89.54 mm2 Kryo (1× 3.0 GHz Cortex-X4 + 4× 2.8 GHz Cortex-A720 + 3× 2.0 GHz Cortex-A520 )Adreno 735 1100 MHz (1689.6 GFLOPS in FP32)Spectra (200 MP Photo Capture, 108 MP single camera @30fps ZSL, 64+36 MP dual camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR) LPDDR5X quad-channel 16-bit (64-bit) 4200 MHz (67.2 GB/s)Internal : X70 5G (5G NR Sub-6 & mmWave: download @ 6.5 Gbit/s, upload @ 3.5 Gbit/s)March 18, 2024 Q1 2024 SM8750-AB Snapdragon 8 Elite 3 nm (TSMC N3E) 124.1 mm2 Oryon (2× 4.32 GHz Prime cores + 6× 3.53 GHz Performance cores)Adreno 830 1100 MHz (3379.2 GFLOPS in FP32)Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 8K@60fps HDR) LPDDR5X quad-channel 16-bit (64-bit) 5300 MHz (84.8 GB/s)Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) FastConnect 7900 : Bluetooth 6.0, 802.11ax/be (Wi-Fi 7) @ 5.8 Gbit/s, GPS , QZSS , Glonass , NavIC , Beidou , Galileo , USB 3.1October 22, 2024 Q4 2024 SM8750-3-AB Oryon (2× 4.32 GHz Prime cores + 5× 3.53 GHz Performance cores)Q1 2025 SM8750-AC Snapdragon 8 Elite for Galaxy Oryon (2× 4.47 GHz Prime cores + 6× 3.53 GHz Performance cores)Adreno 830 1200 MHz (3686.4 GFLOPS in FP32)SM8735 Snapdragon 8s Gen 4 4 nm (TSMC N4P) 105.5 mm2 Kryo (1× 3.21 GHz Cortex-X4 + 3× 3.0 GHz Cortex-A720 + 2× 2.8 GHz Cortex-A720 + 2× 2.02 GHz Cortex-A720 )Adreno 825 1150 MHz (2355.2 GFLOPS in FP32)Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 36 MP triple camera @30fps ZSL; Video Capture: 4K@60fps HDR) LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)Internal (5G NR Sub-6: download up to 4.2 Gbit/s) April 2, 2025 Q2 2025 SM8850-AC Snapdragon 8 Elite Gen 5 3 nm (TSMC N3P) 126.2 mm2 Oryon (2× 4.61 GHz Prime cores + 6× 3.63 GHz Performance cores)Adreno 840 1200 MHz (3686.4 GFLOPS in FP32)Spectra (320 MP Photo Capture, 108 MP single camera @30fps ZSL, 48 MP triple camera @30fps ZSL; Video Capture: 4K@120fps HDR) LPDDR5X quad-channel 16-bit (64-bit) 5300 MHz (84.8 GB/s)Internal: X85 5G (5G NR Sub-6 & mmWave: download 12.5 Gbit/s, upload 3.7 Gbit/s) September 24, 2025 Q3 2025 SM8850-5-AC Oryon (2× 4.61 GHz Prime cores + 5× 3.63 GHz Performance cores)Q1 2026 SM8850-1-AD Snapdragon 8 Elite Gen 5 for Galaxy Oryon (2× 4.74 GHz Prime cores + 6× 3.63 GHz Performance cores)Adreno 840 1300 MHz (3993.6 GFLOPS in FP32)SM8845 Snapdragon 8 Gen 5 103.5 mm2 Oryon (2× 3.8 GHz Prime cores + 6× 3.32 GHz Performance cores)Adreno 829 1225 MHz (2508.8 GFLOPS in FP32)LPDDR5X quad-channel 16-bit (64-bit) 4800 MHz (76.8 GB/s)Internal: X80 5G (5G NR Sub-6 & mmWave: download 10 Gbit/s, upload 3.5 Gbit/s) November 26, 2025 Q4 2025
Mobile Compute Platforms Snapdragon 835 and Snapdragon 850 Model number Product name Fab CPU (ARMv8 )GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability MSM8998 Snapdragon 835 10 nm (Samsung 10LPE) Kryo 280 (4× 2.6 GHz + 4× 1.9 GHz) Adreno 540 710 MHz (363.5 GFLOPS in FP32)Hexagon 682Spectra 180 (Up to 32 MP camera / 16 MP dual) LPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)X16 LTE (download: Cat 16, up to 1000 Mbit/s; 4x20 MHz CA; 256-QAM; 4x4 MIMO on 2C. upload: Cat 13, up to 150 Mbit/s) Bluetooth 5; 802.11ac/ad Wave 2 (MU-MIMO); GPS, GLONASS, Beidou, Galileo, QZSS, SBAS 4 December 5, 2017 Q2 2018 SDM850 Snapdragon 850 10 nm (Samsung 10LPP) Kryo 385 (4× 2.96 GHz + 4× 1.77 GHz) Adreno 630 710 MHz (727 GFLOPS in FP32)Hexagon 685 (3 TOPS)Spectra 280 (192MP single camera / 16MP at 30fps Dual Camera with MFNR/ZSL) LPDDR4X Quad-channel 16-bit (64-bit) 1866 MHz (29.9 GB/s)X20 LTE (download: Cat 18, up to 1200 Mbit/s; 5x20 MHz CA; 256-QAM; 4x4 MIMO on 3C. upload: Cat 13, up to 150 Mbit/s; 2x20 MHz CA; 64-QAM) 4+ June 4, 2018 Q3 2018
Snapdragon 7c/7c+ Compute Platforms Model number Product name Fab CPU (ARMv8 )GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability SC7180 Snapdragon 7c 8 nm (Samsung 8LPP) Kryo 468 2 + 6 cores (2.4 GHz) Adreno 618 825 MHz (422.4 GFLOPS in FP32)Hexagon 692 (5 TOPS)Spectra 255 (32 MP camera, 16 MP dual) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s)X15 LTE download: Cat 15, @ 800 Mbit/s; upload: Cat 13, @ 150 Mbit/s Bluetooth 5; 802.11ax (Wi-Fi 6); GPS , Glonass , SBAS , Beidou , Galileo , QZSS , NavIC; USB 3.1; eMMC 5.1, UFS 3.0 December 5, 2019 Q1 2020 SC7180P Snapdragon 7c Gen 2 Kryo 468 2 + 6 cores (2.55 GHz) May 24, 2021 Q2 2021 SC7280 Snapdragon 7c+ Gen 3 6 nm (TSMC N6) Kryo 4 Gold + 4 Silver cores (Cortex-A78 2.4 GHz + Cortex-A55 1.8 GHz)Adreno 642L 700 MHz (716.8 GFLOPS in FP32)Hexagon (6.5 TOPS)Spectra (64MP single camera or 36+22MP dual camera) LPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.1 GB/s) or LPDDR5 Dual-channel 16-bit (32-bit) 3200 MHz (25.6 GB/s)Internal:X53 5G/LTE (5G: download @ 3.7 Gbit/s, upload @ 2.9 Gbit/s; LTE Cat 24/22: download @ 1200 Mbit/s, upload @ 210 Mbit/s) FastConnect 6700, Bluetooth5.2; 802.11ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS , Glonass , BeiDou , Galileo , QZSS , SBAS , USB 3.1; eMMC 5.1, UFS 2.1, NVMe SSD December 1, 2021 Q1 2022
Snapdragon 8c Compute Platforms Model number Product name Fab CPU (ARMv8 )GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability SC8180 Snapdragon 8c 7 nm (TSMC N7) Kryo 490 4 + 4 cores (2.45 GHz + 1.80 GHz) Adreno 675 590 MHzHexagon 690 (9 TOPS)Spectra 390 (192MP single camera or 22MP at 30fps dual camera with MFNR / ZSL) LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)Internal: X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) External: X55 5G/LTE (5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s) Bluetooth5.0; 802.11ac/ad; GPS , Glonass , SBAS , Beidou , Galileo , QZSS ; USB 3.1; UFS 3.0, NVMe SSD 4+ December 5, 2019 Q1 2020
Snapdragon 8cx Compute Platforms Model number Product name Fab CPU (ARMv8 )GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability SC8180X Snapdragon 8cx 7 nm (TSMC N7) Kryo 495 4 + 4 cores (2.84 GHz Cortex-A76 + 1.80 GHz Cortex-A55 ) Adreno 680 585 MHz (1797.1 GFLOPS in FP32)Hexagon 690 (9 TOPS)Spectra 390 (32MP single camera, 16MP at 30fps dual camera with MFNR / ZSL) LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.3 GB/s)No internal modem Optional external X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) Bluetooth5.0; 802.11ac/ad; GPS , Glonass , SBAS , Beidou , Galileo , QZSS ; USB 3.1; UFS 3.0, NVMe SSD 4+ December 6, 2018 Q3 2019 SC8180XP Snapdragon 8cx Gen 2 5G Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 1.8 GHz Cortex-A55 ) Adreno 690 660 MHz (2027.5 GFLOPS in FP32)No internal modem Optional external X24 LTE (Cat 20: download @ 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload @ 316 Mbit/s, 3x20 MHz CA, 256-QAM) or X55 5G/LTE (5G: download @ 7 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s) Bluetooth5.1; 802.11ax (Wi-Fi 6) 2x2 (MU-MIMO) @ 2.4 Gbit/s, NFC, GPS, Glonass, Beidou, Galileo, QZSS, SBAS, USB 3.1; UFS 3.0. NVMe SSD September 3, 2020 Q3 2020 SC8280 Snapdragon 8cx Gen 3 5 nm (Samsung 5LPE) Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78 )Adreno 695 900 MHz (3686.4 GFLOPS in FP32)Hexagon (15 TOPS)Spectra (24MP at 30fps single camera with MFNR/ZSL) No internal modem Optional external X55 5G/LTE , X62 5G/LTE , X65 5G/LTE (5G: download @ 4.4/7.5/10 Gbit/s, upload @ 3 Gbit/s; LTE Cat 22: download @ 2.5 Gbit/s, upload @ 316 Mbit/s) FastConnect 6900, Bluetooth5.1; 802.11ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS , Glonass , BeiDou , Galileo , QZSS , SBAS , USB 3.1; UFS 3.1, NVMe SSD December 1, 2021 Q1 2022
Microsoft SQ compute platforms Productname Fab CPU (ARMv8 )GPU DSP ISP Memory technology Modem Connectivity Quick Charge Announcement Date Sampling availability Microsoft SQ1 7 nm (TSMC N7) Kryo 495 4 + 4 cores (3 GHz Cortex-A76 + 1.80 GHz Cortex-A55 ) Adreno 685 590MHz (1812.5 GFLOPs in FP32)Hexagon 690 (9 TOPS)Spectra 390 (192MP single camera / 22 MP at 30fps dual camera with MFNR/ZSL) LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)No internal modem Optional external X24 LTE (Cat 20: download up to 2 Gbit/s, 7x20 MHz CA, 256-QAM, 4x4 MIMO on 5C. Upload up to 316 Mbit/s, 3x20 MHz CA, 256-QAM) Bluetooth5.0; 802.11ac/ad; GPS , GLONASS , Beidou , Galileo , QZSS , SBAS ; USB 3.1; UFS 3.0, NVMe SSD 4+ October 2, 2019 Q4 2019 Microsoft SQ2 Kryo 495 4 + 4 cores (3.15 GHz Cortex-A76 + 2.42 GHz Cortex-A55 ) Adreno 690 680MHz (2089 GFLOPs in FP32)October 1, 2020 Q4 2020 Microsoft SQ3 5 nm (Samsung 5LPE) Kryo 4 + 4 cores (3.0 GHz Cortex-X1 + 2.40 GHz Cortex-A78 )Adreno 695 900MHz (3686.4 GFLOPS in FP32)Hexagon (15 TOPS)Spectra (24 MP at 30fps single camera with MFNR/ZSL) No internal modem Optional external X62 5G/LTE , X55 5G/LTE , X65 5G/LTE (5G: download up to 4.4/7.5/10 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) FastConnect 6900, Bluetooth5.1; 802.11ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS , GLONASS , BeiDou , Galileo , QZSS , SBAS , USB 3.1; UFS 3.1, NVMe SSD Q3 2022
Snapdragon X series The Snapdragon X series is a family of Qualcomm systems on chips (SoCs) designed primarily for Windows PCs and related form factors, using Arm-based CPU designs and integrating GPU and on-device AI acceleration in a single platform. The series was introduced with the Snapdragon X Elite in October 2023 and expanded with additional tiers including Snapdragon X Plus in April 2024 and Snapdragon X in January 2025, with the lineup positioned to span premium through more mainstream PC designs.
Snapdragon X1 series The Snapdragon X1 series comprises the first generation of Snapdragon X laptop-focused SoCs, including Snapdragon X Elite (model prefix X1E), Snapdragon X Plus (X1P), and Snapdragon X (X1), which share common platform elements such as Qualcomm's Oryon CPU branding, Adreno integrated graphics, and a Hexagon NPU specified by Qualcomm at up to 45 TOPS for on-device AI workloads across multiple X1 configurations.
Productname Modelnumber Fab Die size CPU (Cores/Freq)GPU DSP /NPU ISP Memory technology Modem (external/optional) Connectivity (external) Announcement Date Sampling availability SnapdragonX X1-26-100 4 nm (TSMCN4) Oryon 8 core (3.0 GHz)Adreno X1-45 1107 MHz (1.7 TFLOPS)Hexagon (45 TOPS)Spectra (36 MP single camera) LPDDR5X-8448 Octa-channel 16-bit (128-bit) @ 4224 MHz (135 GB/s) X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) FastConnect 7800, Bluetooth5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS , GLONASS , BeiDou , Galileo , QZSS , SBAS , USB4 ; UFS 4.0, NVMe SSD January 6, 2025 Q1 2025 SnapdragonXPlus X1P-42-100 Oryon 8 core (3.2 GHz, single-core boost up to 3.4 GHz) April 24, 2024 Q2 2024 X1P-46-100 Oryon 8 core (3.4 GHz, single-core boost up to 4.0 GHz) Adreno X1-45 1367 MHz (2.1 TFLOPS) X1P-64-100 172.7 mm2 Oryon 10 core (3.4 GHz) Adreno X1-85 1250 MHz (3.8 TFLOPS) Spectra (64 MP single camera / 36 MP dual camera) X1P-66-100 Oryon 10 core (3.4 GHz, single-core boost up to 4.0 GHz) SnapdragonXElite X1E-78-100 Oryon 12 core (3.4 GHz) October 24, 2023 Q2 2024 X1E-80-100 Oryon 12 core (3.4 GHz, single and dual-core boost up to 4.0 GHz) X1E-84-100 Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.2 GHz) Adreno X1-85 1500 MHz (4.6 TFLOPS) X1E-00-1DE Oryon 12 core (3.8 GHz, single and dual-core boost up to 4.3 GHz)
Snapdragon X2 series The Snapdragon X2 series is the successor generation to the X1 series for Windows PCs, introduced by Qualcomm in late 2025 with higher-tier Snapdragon X2 Elite and X2 Elite Extreme variants and followed in early 2026 by the Snapdragon X2 Plus tier. Qualcomm's published materials describe the X2 generation as increasing the platform's on-device AI capability to an 80 TOPS Hexagon NPU and scaling CPU configurations up to 18 Oryon-branded cores in the flagship tier, while product announcements and coverage indicate initial device availability in 2026.
Productname Modelnumber Fab Die size CPU (Cores/Freq)GPU DSP /NPU ISP Memory technology Modem (external/optional) Connectivity (external) Announcement Date Sampling availability SnapdragonX2Plus X2P-42-100 3 nm (TSMC N3P+N3X)Oryon 6 core (4.04 GHz)Adreno X2-45 910 MHzHexagon (80 TOPS)Spectra (36 MP single/38 MP dual camera) LPDDR5X-9523 Octa-channel 16-bit (128-bit) @ 4761.5 MHz (152 GB/s) X65 5G/LTE (5G: download up to 10 Gbit/s, upload up to 3.5 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 316 Mbit/s) FastConnect 7800, Bluetooth5.4; 802.11ac/ax/be (Wi-Fi 7) 2x2 (MU-MIMO) @ 3.6 Gbit/s; GPS , GLONASS , BeiDou , Galileo , QZSS , SBAS , USB4 ; UFS 4.0, NVMe SSD January 5, 2026 Q1 2026 X2P-64-100 Oryon 10 core (4.04 GHz) Adreno X2-45 1700 MHz SnapdragonX2Elite X2E-78-100 Oryon 12 core (4.0 GHz) Adreno X2-85 1350 MHz Q1 2026 X2E-80-100 Oryon 12 core (4.0 GHz, single-core boost up to 4.7 GHz, dual-core boost up to 4.4 GHz) Adreno X2-85 1700 MHz September 24, 2025 Q4 2025 X2E-84-100 Oryon 12 core (4.0 GHz, single-core and dual core boost up to 4.7 GHz) Hexagon (85 TOPS) Q1 2026 X2E-88-100 Oryon 18 core (4.0 GHz, single-core and dual-core boost up to 4.7 GHz) Adreno X2-90 1700 MHz (6.9 TFLOPS) Hexagon (80 TOPS) September 24, 2025 Q4 2025 X2E-90-100 Oryon 18 core (4.0 GHz, single-core and dual-core boost up to 5.0 GHz) Hexagon (85 TOPS) Q1 2026 SnapdragonX2 EliteExtreme X2E-94-100 Oryon 18 core (4.4 GHz, single-core and dual-core boost up to 4.7 GHz) Adreno X2-90 1850 MHz (7.5 TFLOPS) Hexagon (80 TOPS) LPDDR5X-9523 Dodeca-channel 16-bit (192-bit) @ 4761.5 MHz (228 GB/s) X2E-96-100 Oryon 18 core (4.4 GHz, single-core and dual-core boost up to 5.0 GHz) September 24, 2025 Q4 2025
Hardware codec supported See: Qualcomm Hexagon
Wearable platforms Model number Product name Fab CPU Co-processor GPU DSP /NPU Memory technology Modem Connectivity Announcement Date Sampling availability ? Wear 1100 28 nm 1 core up to 1.2 GHz Cortex-A7 (ARMv7 ) —N/a Fixed Function GPU LPDDR2 Integrated 2G/3G/LTE (Cat 1, up to 10/5 Mbit/s) Bluetooth 4.1; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou May 30, 2016 Q2 2016 Wear 1200 1 core up to 1.3 GHz Cortex-A7 (ARMv7 ) Integrated 2G/LTE (Cat M1, up to 300/350 kbit/s) Bluetooth 4.2; 802.11a/b/g/n/ac; GPS, GLONASS, Galileo, BeiDou June 27, 2017 Q2 2017 MSM8909w Wear 2100 4 cores up to 1.2 GHz Cortex-A7 (ARMv7 ) Adreno 304Hexagon LPDDR3 400 MHzX5 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 4.1; 802.11b/g/n; NFC; GPS, GLONASS, Galileo, BeiDou February 10, 2016 Q1 2016 Wear 2500 June 26, 2018 Q2 2018 Wear 3100 QCC1110 (1 core 50 MHz Cortex-M0 ) September 10, 2018 Q3 2018 SDM429w Wear 4100 12 nm 4 cores up to 2.0 GHz Cortex-A53 (ARMv8-A ) —N/a Adreno 504 320 MHzHexagon QDSP6 V56LPDDR3 Single-channel 32-bit 750 MHz (6.0 GiB/s)Bluetooth 5.0; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou June 30, 2020 Q2 2020 Wear 4100+ 12 nm + 28 nm QCC1110 (1 core 50 MHz Cortex-M0 ) SW5100 W5 Gen 1 4 nm 4 cores up to 1.7 GHz Cortex-A53 (ARMv8-A ) —N/a Adreno A702 1 GHzHexagon DSP V66KLPDDR4 Single-channel 16-bit 2133 MHz (8.5 GiB/s)Integrated 2G/3G/LTE (Cat 4, up to 150/50 Mbit/s) Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou July 19, 2022 Q3 2022 W5+ Gen 1 4 nm + 22 nm QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55) W5/W5+ Gen 2 W5 Gen 2 4 nm —N/a Integrated 2G/3G/LTE (Release 17 w/Category 1bix) Bluetooth 5.3; 802.11a/b/g/n; NFC; GPS; GLONASS, Galileo, BeiDou, NB-NTN August 20, 2025 - W5+ Gen 2 4 nm + 22 nm QCC5100 (1 core 250 MHz Cortex-M55 + Ethos-U55) Wear Elite Snapdragon Wear Elite 3 nm 1× Cortex-A78 up to 2.1 GHz + 4× Cortex-A55 up to 1.95 GHz (ARMv8-A) 500 MHz Adreno A622Hexagon (12 TOPS)LPDDR5 Single-channel 16-bit 3200 MHz (12.8 GiB/s)5G RedCap Rel-17; LTE TDD/FDD; 3G/WCDMA; NB-NTN Bluetooth 5.3/6.0; Wi-Fi 6 (802.11ax, 2.4/5/6 GHz, 1×1); UWB; GNSS (L1/L5); NFC March 2, 2026 –
Automotive platforms The Snapdragon 602A, for application in the motor industry, was announced on January 6, 2014. The Snapdragon 820A was announced on January 6, 2016.
Snapdragon Automotive Cockpit platform SA4150P SA4155P SA6145P SA6150P SA6155 SA6155P • SA7255P SA8145P SA8150P SA8155 SA8155P • SA8195P • SA8255P • SA8295P • Snapdragon Ride & Ride Flex platform SA8540P SA8620P SA8650P SA8770P SA8775P SA9000P • AI Accelerator Snapdragon Cockpit Elite Snapdragon Digital Chassis Snapdragon Ride Elite Qualcomm Oryon CPU
Productname (Modelnumber) Fab CPU (Core/Freq)GPU DSP Memory technology Modem Connectivity Sampling availability Snapdragon 602A (APQ8064-AU) 28 nm (TSMC 28LP) Krait 300 4 cores 1.51 GHz (ARMv7 )Adreno 320 400 MHz (76.8 GFLOPs) (2048x1536 + 1080p external display)Hexagon QDSP6 V4 500 MHzLPDDR3 Dual-channel 32-bit 533 MHz (8.5 GB/s)External: Gobi MDM9615 LTE:FDD/TDDCat3 CDMA: EV-DOrB/rA 1x UMTS: TD-SCDMA, DC-HSPA+/HSPA GSM: EDGE/GPRS Bluetooth 4.1 + BLE Qualcomm VIVE QCA6574 802.11ac (Wi-Fi 5) 2x2 (MU-MIMO) Q1 2014 Snapdragon 820AM (APQ8096AU/ MSM8996AU) 14 nm (Samsung 14LPP) Kryo 2 + 2 cores (2.15 GHz Gold + 1.59 GHz Silver) (ARMv8 )Adreno 530 624 MHz (319.4 GFLOPs)Hexagon 680 1.0 GHzLPDDR4X Dual-channel 32-bit (64-bit) 1866 MHz (29.9 GB/s)Internal: APQ: no MSM: X12 LTE Download: Cat 12, 600 Mbit/s Upload: Cat 13, 150 Mbit/s Bluetooth 4.1 802.11ac (Wi-Fi 5) IZat Gen8C Q1 2016 SA6155P 11 nm (Samsung 11LPP) Kryo 460 2 + 6 cores (2.0 GHz Gold + 1.6 GHz Silver) Adreno 608/612 430 MHz (110 GFLOPs)Hexagon 685 V6 DSP, Spectra 230 ISPLPDDR4X Dual-channel 16-bit (32-bit) 2133 MHz (17.0 GB/s)Internal: no Bluetooth 5.0 802.11ac (Wi-Fi 5) GPS, Glonass, Beidou, Galileo, QZSS, SBAS Q1 2019 Snapdragon 855A (SA8155P) 7 nm (TSMC N7) Kryo 485 1 + 3 + 4 cores (2.96 GHz Prime + 2.42 GHz Gold + 1.79 GHz Silver) Adreno 640 675 MHz (1036.8 GFLOPs)Hexagon 690 (10 TOPS) LPDDR4X Quad-channel 16-bit (64-bit) 2133 MHz (34.1 GB/s)X24 LTE Modem FDD·TDD Cat.20 2Gbps/316Mbps 7·3CA / VoLTE, 3G GSM, CDMA 2000, TD-SCDMA, 2G GSM/CDMA Bluetooth 5.0 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS Q1 2021 SA8195P Kryo 495 4 + 4 cores (Cortex-A76 + Cortex-A55 ) Adreno 680 600 MHz (1843.2 GFLOPs)Hexagon Internal: no Bluetooth 5.0 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS SA8255P 5 nm (Samsung 5LPE) Kryo 4 + 4 cores (2.35 GHz Prime + 2.35 GHz Gold)Adreno 663Hexagon LPDDR5 Hexa-channel 16-bit (96-bit) 3200 MHz (76.8 GB/s)Bluetooth 5.2 802.11ax (Wi-Fi 6) GPS, Glonass, Beidou, Galileo, QZSS, SBAS SA8295P Kryo 695 4 + 4 cores (2.56 GHz Cortex-X1 + 2.05 GHz Cortex-A78 ) Adreno 695Hexagon (30 TOPS)LPDDR4X Octa-channel 16-bit (128-bit) 2133 MHz (68.2 GB/s)Bluetooth 5.2 802.11ax (Wi-Fi 6) 2x2 (MU-MIMO) @ 1.7 Gbit/s GPS, Glonass, Beidou, Galileo, QZSS, SBAS 2023
Embedded platforms The Snapdragon 410E Embedded and Snapdragon 600E Embedded were announced on September 28, 2016. The Snapdragon 800 for Embedded The Snapdragon 810 for Embedded The Snapdragon 820E Embedded was announced on February 21, 2018.
Productname (Modelnumber) Fab CPU (Cores/Freq)GPU DSP ISP Memory technology Modem Connectivity Sampling availability Snapdragon 410E (APQ8016E) 28 nm (TSMC 28LP) 4 cores up to 1.2 GHz Cortex-A53 (ARMv8 ) Adreno 306Hexagon QDSP6 V5 691 MHzUp to 13 MP camera LPDDR2 /3 Single-channel 32-bit 533 MHz (4.2 GB/s)none Bluetooth 4.0, 802.11n, GPS Snapdragon 600E (APQ8064E) 4 cores up to 1.5 GHz Krait 300 (ARMv7 ) Adreno 320 400 MHzHexagon QDSP6 V4 500 MHzUp to 21 MP camera DDR3/DDR3L Dual-channel 533 MHz Bluetooth 4.0, 802.11a/b/g/n/ac (2.4/5 GHz), IZat Gen8A Snapdragon 800E (APQ8074) 28 nm (TSMC 28HPM) 4 cores up to 2.3 GHz Krait 400 (ARMv7 ) Adreno 330Hexagon QDSP6 V5Up to 55 MP camera LPDDR3 Dual-channel 32-bit 800 MHz (12.8 GB/s)Bluetooth 4.1 ; 802.11n /ac (2.4/5 GHz); IZat Gen8B; NFC, Gigabit Ethernet, HDMI, DisplayPort, SATA, SDIO, UART, I2C, GPIOs, JTAG; USB 3.0/2.0Snapdragon 810E (APQ8094) 20 nm (TSMC 20SoC) 4 + 4 cores 2.0 GHz Cortex-A57 + 1.55 GHz Cortex-A53 (ARMv8 ) Adreno 430 650 MHzHexagon V56 800 MHzUp to 55 MP camera LPDDR4 Dual-channel 32-bit 1600 MHz (25.6 GB/s)Bluetooth 4.1; 802.11ac; IZat Gen8C Snapdragon 820E (APQ8096) 14 nm FinFET (Samsung 14LPP) 2 + 2 cores (2.15 GHz + 1.6 GHz) Kryo (ARMv8 ) Adreno 530Hexagon 680 825 MHzUp to 28 MP camera LPDDR4 Quad-channel 16-bit (64-bit) 1866 MHz (29.8 GB/s)Bluetooth 4.1; 802.11ac /ad; IZat Gen8C
Vision Intelligence Platform The Qualcomm Vision Intelligence Platform was announced on April 11, 2018. The Qualcomm Vision Intelligence Platform is purpose built to bring powerful visual computing and edge computing for machine learning to a wide range of IoT devices.
Modelnumber Fab CPU (ARMv8 )GPU DSP ISP Memory technology Modem Connectivity Quick Charge Sampling availability QCS603 10 nm (Samsung 10LPP) 2 + 2 cores (1.6 GHz Kryo 360 Gold + 1.7 GHz Kryo 360 Silver) Adreno 615 (Quad HD + 4K Ultra HD external display)Hexagon 685Spectra270 (Up to 24 MP camera / 16 MP dual) LPDDR4X 16-bit 1866 MHznone Bluetooth 5.0, NFC , 802.11ac 1x1 (MU-MIMO) Wi-Fi up to 433 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1 4+ QCS605 8 cores up to 2.5 GHz Kryo 300 Spectra 270 (Up to 32 MP camera / 16 MP dual) Bluetooth 5.0, NFC , 802.11ac 2x2 (MU-MIMO) Wi-Fi up to 867 Mbit/s, GPS, GLONASS, Beidou, Galileo, QZSS, SBAS, USB 3.1
Home Hub and Smart Audio platforms The Qualcomm Smart Audio Platform (APQ8009 and APQ8017) was announced on June 14, 2017. The Qualcomm 212 Home Hub (APQ8009) and Qualcomm 624 Home Hub (APQ8053) were announced on January 9, 2018.
The QCS400 Series was announced March 19, 2019.
Modelnumber Fab CPU (Cores/Freq)GPU DSP ISP Audio Memory technology Modem Connectivity Sampling availability APQ8009 (SDA212) 28 nm (TSMC 28LP) 4 cores up to 1.3 GHz Cortex-A7 (ARMv7 ) Adreno 304 (HD)Hexagon 536Up to 16 MP camera LPDDR2 /3 Single-channel 533 MHznone Bluetooth 4.2 + BLE, 802.11ac (2.4/5 GHz) Wi-Fi APQ8017 4 cores up to 1.4 GHz Cortex-A53 (ARMv8 ) Adreno 308 (Full HD)LPDDR3 Single-channel 667 MHzAPQ8053 (SDA624) 14 nm (Samsung 14LPP) 8 cores up to 1.8 GHz Cortex-A53 (ARMv8 ) Adreno 506 (Full HD+)Hexagon 546Up to 24 MP camera, 13 MP dual LPDDR3 QCS403 Dual-core CPU none 2x Hexagon V66 12× audio channels supported Bluetooth 5.1; 802.11ax-ready, 802.11ac, 4x4 (MIMO); Zigbee/15.4 Q1 2019 QCS404 Quad-core CPU QCS405 Adreno 306 (Full HD+)QCS407 32× audio channels supported
Mixed Reality (MR) platforms Snapdragon XR series Snapdragon XR1 was announced in May 2018, is designed for Augmented reality , Virtual reality and mixed reality .Snapdragon XR2 was announced in December 2019, and is a derivative of the Snapdragon 865.It is used in the Meta Quest 2 , the HTC Vive Focus 3 and the Pico 4 .
Snapdragon XR2+ Gen 1 was announced on October 11, 2022, and is used in the Meta Quest Pro .Snapdragon XR2 Gen 2 is announced in September 2023. Qualcomm claims improved performance compared to its predecessor XR2 5G.The SoC can handle up to 10 concurrent sensors & cameras, per-eye resolution of 3K x 3K and 12ms full-color video pass-through.
It supports Wi-Fi 7 network. It is integrated into Meta Quest 3 and Pico 4 Ultra .
Snapdragon XR2+ Gen 2 is an overclocked version of the XR2 Gen 2. It is integrated into Samsung Galaxy XR .Productname Fab Die size CPU (ARMv8 )GPU DSP ISP Memory technology Tracking Connectivity Sampling availability XR1 10 nm (Samsung 10LPP) 4x Kryo 385 Gold + 4x Kryo 385 Silver Adreno 615 Hexagon 685 Spectra LPDDR4X Quad-channel 16-bit (64-bit)3DoF and 6DoF head and controller tracking Wi-Fi 5 Bluetooth 5 Q1 2019 XR2 7 nm (TSMC N7+) 1x Kryo 585 Prime (2.84 GHz) + 3x Kryo 585 Gold (2.42 GHz) + 4x Kryo 585 Silver (1.80 GHz) Adreno 650 (up to 2x 3K displays at 90 Hz)Hexagon 698 Spectra (input from up to 7 cameras) Full 6DoF head and controller tracking, as well as hand and finger tracking Wi-Fi 6 Bluetooth 5 5G Q1 2020 XR2+ Gen 1 LPDDR5 Quad-channel 16-bit (64-bit)Wi-Fi 6E Bluetooth 5.2 5G Q4 2022 XR2 Gen 2 4 nm (Samsung 4LPX) 115.8 mm2 4x Kryo (Cortex-A78C 2.36 GHz) + 2x Kryo (Cortex-A78C 2.05 GHz) Adreno 740 (up to 2x 3K displays at 90 Hz)Hexagon Spectra (input from up to 10 cameras) LPDDR5X Quad-channel 16-bit (64-bit)Wi-Fi 7 Bluetooth 5.3 5G Q4 2023 XR2+ Gen 2 4x Kryo (Cortex-A78C ) + 2x Kryo (Cortex-A78C) Adreno 740 (up to 2x 4.3K displays at 90 Hz)Hexagon Spectra (input from up to 12 cameras) Q1 2024
Snapdragon AR series The Qualcomm Snapdragon AR2 Gen 1 Platform was announced November 17, 2022. It is intended for use in smart glasses. On September 27, 2023 Qualcomm announced the Snapdragon AR1 Gen 1 Platform for slim and light AR glasses. It is designed to enable personal assistants, audio quality enhancement, visual search, and real-time translation using on-device AI acceleration. The platform supports binocular displays with up to 1280 x 1280 resolution for heads-up information and also content consumption. The new 14-bit ISP can capture 12MP photos and 6MP video recording & live-streaming. Head tracking is limited to 3DoF (three degrees of freedom).
Gaming platforms Snapdragon G series In December 2021, Qualcomm announced the Snapdragon G3x Gen 1 Gaming Platform. The Razer Edge is the first device to use the platform.
The G3x Gen 1 is based on the Snapdragon 888+ as it has the same motherboard code name (Lahaina ), the same CPU clusters with higher clock speeds, and the same GPU with a higher clock speed. Connectivity options also seem in line.
In August 2023, Qualcomm announced the Snapdragon G series platform designed for handheld gaming devices.
On March 19, 2025, Qualcomm revealed the Snapdragon G3 Gen 3, G2 Gen 2, and G1 Gen 2 platforms.
Productname Fab CPU (Cores/Freq)GPU Modem Connectivity Display Sampling availability G1 Gen 1 Unknown Kryo (8 core) Adreno A11 —N/a Bluetooth 5.0; 802.11a/b/g/n/ac (Wi-Fi 5) 1x1HD at 60 fps Q4 2023 G1 Gen 2 4 nm (Samsung 4LPX)2 + 6 cores (2x 2.4 GHz Kryo Gold – Cortex-A78 + 6x 1.96 GHz Kryo Silver – Cortex-A55 ) Adreno A12 1010 MHz (258.6 GFLOPS in FP32) X61 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)Bluetooth 5.1; 802.11a/b/g/n/ac (Wi-Fi 5) 1x1FHD+ up to 120 fps Q1 2025 G2 Gen 1 Kryo 4 + 4 cores (Cortex-A78 + Cortex-A55 )AdrenoA21 X62 5G/LTE (5G NR Sub-6 & mmWave: download up to 4.4 Gbit/s, upload up to 1.6 Gbit/s)FastConnect 6700; Bluetooth 5.0; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) 2x2 (MU-MIMO) up to 2.9 Gbit/s; FHD+ up to 144 fps Q4 2023 G2 Gen 2 4 nm (TSMC N4P) Kryo (Cortex-X4 + 4× Cortex-A720 + 3× Cortex-A520 )AdrenoA22 X61 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)FastConnect7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s QHD+ up to 144 fps Q1 2025 G3x Gen 1 5 nm (Samsung 5LPE) 1x 3.0 GHz Kryo 680 Prime (Cortex-X1 ) + 3x 2.42 GHz Kryo 680 Gold (Cortex-A78 ) + 4x 1.80 GHz Kryo 680 Silver Cortex-A55 ) Adreno660 900 MHz (1382.4 GFLOPs in FP32) X60 5G (5G NR Sub-6 & mmWave: download up to 7.5 Gbit/s, upload up to 3 Gbit/s; LTE Cat 22: download up to 2.5 Gbit/s, upload up to 0.316 Gbit/s)FastConnect6900; Bluetooth 5.2; 802.11a/b/g/n/ac/ax (Wi-Fi 6E) up to 3.6 Gbit/s FHD+ up to 144 fps Q1 2023 G3x Gen 2 4 nm (TSMC N4) 1× 3.36 GHz Kryo Prime (Cortex-X3 ) + 4× 2.8 GHz Kryo Gold (2× Cortex-A715 2× Cortex-A710 ) + 3× 2.02 GHz Kryo Silver (Cortex-A510 ) AdrenoA32 1000 MHz (3072 GFLOPS in FP32) X70 5G (5G NR Sub-6 & mmWave: download up to 10 Gbit/s, upload up to 3.5 Gbit/s)FastConnect7800; Bluetooth 5.3; 802.11a/b/g/n/ac/ax/be (Wi-Fi 7) up to 5.8 Gbit/s Q4 2023 G3 Gen 3 4 nm (TSMC N4P) Kryo (1× 3.3 GHz Cortex-X4 + 3× 3.15 GHz Cortex-A720 + 2× 2.96 GHz Cortex-A720 + 2× 2.27 GHz Cortex-A520 )AdrenoA33 X61 5G (5G NR Sub-6 & mmWave: download up to 2.5 Gbit/s, upload up to 900 Mbit/s)QHD+ up to 144 fps Q1 2025
Bluetooth SoC platforms Following Qualcomm's acquisition of CSR in 2015, Qualcomm designs ultra-low-power Bluetooth SoCs under the CSR, QCA and QCC brands for wireless headphones and earbuds. Qualcomm has worked with both Amazon and Google on reference designs to help manufacturers develop headsets with support for Alexa , Google Assistant and Google Fast Pair . Qualcomm announced the QCC5100 Series at CES 2018.
On January 28, 2020, the QCC304x and QCC514x SoCs were published as Bluetooth 5.2 certified by the Bluetooth SIG. On the previous day Qualcomm published a blog post on LE Audio, referring to the QCC5100 series. On March 25, 2020, the BLE Audio QCC304x and QCC514x SoCs were officially announced.
Qualcomm QCC300x Series Bluetooth audio SoCs Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Sampling availability QCC3001 RISC application processor (Up to 80 MHz) Single core Qualcomm Kalimba DSP (Up to 80 MHz) Bluetooth 5.0 Dual-mode Bluetooth TrueWireless Stereo cVc audio Mono / 2-mic QCC3002 TrueWireless Stereo aptX Classic/HD/LLcVc audio QCC3003 cVc audio Stereo / 1-mic QCC3004 Stereo / 2-mic QCC3005 aptX Classic/HD/LL cVc audio
Qualcomm QCC30xx Series Bluetooth audio SoCs Model number Fab CPU DSP Bluetooth Technologies support Power consumption DAC output / Digital microphone input Digital assistant activation Sampling availability QCC3020 Dual core 32-bit application processor (Up to 80 MHz) Single core Qualcomm Kalimba DSP (Up to 120 MHz) Bluetooth 5.0 Bluetooth Low Energy sensor hub, Dual-mode BluetoothBluetooth Speed: 2 Mbit/s aptX Classic/HD/LL TrueWireless Stereo PluscVc audio ~6mA (2DP streaming) Mono / 2-mic Button press H1 2017 QCC3021 Stereo / 1-mic QCC3024 cVc audio Google Fast Pair Stereo / 2-mic QCC3026 aptX Classic/HD/LL TrueWireless Stereo PluscVc audio Mono / 2-mic QCC3031 aptX Classic/HD/LL TrueWireless Stereo PluscVc audio Stereo / 1-mic QCC3034 aptX Classic/HD/LL cVc audioGoogle Fast Pair Mono / 2-mic QCC3040 Dual core 32-bit application processor (Up to 80 MHz) Single core Qualcomm Kalimba DSP (Up to 120 MHz) Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Bluetooth speed: 2 Mbit/s aptX Classic/HD TrueWireless mirroringANC (Feedforward/feedback and hybrid)cVc audioGoogle Fast Pair <5 mA Stereo / 2-mic Button press H1 2020 QCC3046 <5 mA
Qualcomm QCC510x Series Bluetooth audio SoCs Model number Fab CPU DSP Bluetooth Technologies support Power consumption Digital assistant activation Sampling availability QCC5120 Dual core 32-bit application processor (Up to 80 MHz) Dual core Qualcomm Kalimba DSP (Up to 120 MHz) Bluetooth 5.0 Bluetooth Low Energy, Bluetooth Low Energy sensor hub, Dual-mode BluetoothBluetooth Speed: 2 Mbit/s aptX Classic/HD/LL eXtension programTrueWireless Stereo PlusANC (FeedForward/Feedback and Hybrid)cVc audioGoogle Fast Pair ~6mA (2DP streaming) ~7mA HFP Narrow Band, 1 Digital MIC cVc Button press Qualcomm Voice Activation H1 2018 QCC5121 QCC5124 QCC5125 Single core Qualcomm Kalimba DSP (Up to 120 MHz) aptX Classic/HD/LL eXtension programTrueWireless Stereo PlusANC (FeedForward/Feedback)cVc audioGoogle Fast Pair ~10mA (2DP streaming) ~10mA HFP Narrow Band, 1 Digital MIC cVc Button press QCC5141 Dual core 32-bit application processor (Up to 80 MHz) Dual core Qualcomm Kalimba DSP (Up to 120 MHz) Bluetooth 5.2 BLE Audio, Bluetooth Low Energy sensor hub, Bluetooth Low Energy, Dual-mode Bluetooth Speed: 2 Mbit/s aptX Adaptive eXtension programTrueWireless MirroringANC (FeedForward/Feedback)cVc audioGoogle Fast Pair ~5mA A2DP stream Button press Qualcomm Voice Activation H1 2020 QCC5144
See also External links Media related to Snapdragon (microprocessor) at Wikimedia Commons , product page